Robert Sankman
Impact in
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Low-power high-performance VLSI design
- Semiconductor materials and devices
- Advanced Memory and Neural Computing
- Electromagnetic Compatibility and Noise Suppression
Papers in
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- 3D IC and TSV technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- VLSI and FPGA Design Techniques 2
- Energy Harvesting in Wireless Networks 2
- Wireless Power Transfer Systems 1
- Low-power high-performance VLSI design 1
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- Innovative Energy Harvesting Technologies 2
- Co-authors
- Debendra Mallik (4 shared papers)Ravi Mahajan (2 shared papers)Dae Woo Kim (1 shared paper)Kemal Aygün (1 shared paper)Deepti Iyengar (1 shared paper)Islam A. Salama (1 shared paper)Yidnekachew S. Mekonnen (1 shared paper)Zhiguo Qian (1 shared paper)
- Journals
- IEEE Journal of Solid-State Circuits (1 paper)IEEE Transactions on Advanced Packaging (1 paper)Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena (1 paper)
- Partner nations
- United StatesMalaysia
In The Last Decade
Robert Sankman
8 papers receiving 311 citations
Peers
Comparison fields: 5 of 31
- Hardware and Architecture 79
- Electrical and Electronic Engineering 301
- Computer Networks and Communications 42
- Biomedical Engineering 54
- Automotive Engineering 14
Countries citing papers authored by Robert Sankman
This map shows the geographic impact of Robert Sankman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Sankman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Sankman more than expected).
Fields of papers citing papers by Robert Sankman
This network shows the impact of papers produced by Robert Sankman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Sankman. The network helps show where Robert Sankman may publish in the future.
Co-authors
The 22 scholars most cited alongside Robert Sankman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 245 | |
| 2 | 2017 | 46 | |
| 3 | 2016 | 19 | |
| 4 | 2001 | 9 | |
| 5 | 2006 | 8 | |
| 6 | 2002 | 4 | |
| 7 | 1997 | 3 | |
| 8 | 2002 | 2 |
About Robert Sankman
Robert Sankman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Mechanics of Materials and Materials Chemistry, having authored 8 papers that have together received 336 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Innovative Energy Harvesting Technologies (2 papers), VLSI and FPGA Design Techniques (2 papers), Energy Harvesting in Wireless Networks (2 papers), Advanced Thermoelectric Materials and Devices (1 paper), Wireless Power Transfer Systems (1 paper) and Low-power high-performance VLSI design (1 paper). The work is most often cited by research in Hardware and Architecture (79 citations), Electrical and Electronic Engineering (301 citations), Computer Networks and Communications (42 citations), Biomedical Engineering (54 citations) and Automotive Engineering (14 citations). Robert Sankman has collaborated with scholars based in United States and Malaysia. Frequent co-authors include Debendra Mallik, Ravi Mahajan, Dae Woo Kim, Kemal Aygün, Deepti Iyengar, Islam A. Salama, Yidnekachew S. Mekonnen, Zhiguo Qian, Neha Patel and Vivek De. Their work appears in journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Advanced Packaging and Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.