Bill Eklow
Impact in
- Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing
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- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Radiation Effects in Electronics
Papers in
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- Integrated Circuits and Semiconductor Failure Analysis 18
- 3D IC and TSV technologies 8
- Semiconductor materials and devices 3
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- VLSI and Analog Circuit Testing 16
- Embedded Systems Design Techniques 3
- Co-authors
- Li Jiang (5 shared papers)Qiang Xu (5 shared papers)Krishnendu Chakrabarty (4 shared papers)Jeff Rearick (2 shared papers)Xinli Gu (2 shared papers)Alfred L. Crouch (1 shared paper)C. Barnhart (3 shared papers)Huiyun Li (1 shared paper)
- Journals
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (3 papers)Proceedings Design, Automation and Test in Europe Conference and Exhibition (1 paper)Design, Automation, and Test in Europe (1 paper)IEEE Design & Test of Computers (2 papers)Lund University Publications (Lund University) (1 paper)
- Partner nations
- United StatesChinaHong Kong
In The Last Decade
Bill Eklow
26 papers receiving 490 citations
Peers
Comparison fields: 5 of 23
- Hardware and Architecture 245
- Electrical and Electronic Engineering 445
- Automotive Engineering 86
- Industrial and Manufacturing Engineering 35
- Computer Networks and Communications 79
Countries citing papers authored by Bill Eklow
This map shows the geographic impact of Bill Eklow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bill Eklow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bill Eklow more than expected).
Fields of papers citing papers by Bill Eklow
This network shows the impact of papers produced by Bill Eklow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bill Eklow. The network helps show where Bill Eklow may publish in the future.
Co-authors
The 23 scholars most cited alongside Bill Eklow, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 72 | |
| 2 | 2012 | 64 | |
| 3 | 2013 | 64 | |
| 4 | 2006 | 44 | |
| 5 | 2013 | 34 | |
| 6 | 2006 | 33 | |
| 7 | 2006 | 28 | |
| 8 | 2012 | 26 | |
| 9 | 2006 | 22 | |
| 10 | 2006 | 16 | |
| 11 | 2005 | 15 | |
| 12 | 2004 | 13 | |
| 13 | 2014 | 11 | |
| 14 | 2013 | 10 | |
| 15 | 2006 | 8 | |
| 16 | 2003 | 8 | |
| 17 | 2003 | 7 | |
| 18 | 2012 | 7 | |
| 19 | 2014 | 6 | |
| 20 | 2015 | 6 |
About Bill Eklow
Bill Eklow is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Control and Systems Engineering, Automotive Engineering and Computer Networks and Communications, having authored 28 papers that have together received 510 indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (18 papers), VLSI and Analog Circuit Testing (16 papers), Engineering and Test Systems (11 papers), 3D IC and TSV technologies (8 papers), Embedded Systems Design Techniques (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers), Semiconductor materials and devices (3 papers) and Nanofabrication and Lithography Techniques (2 papers). The work is most often cited by research in Hardware and Architecture (245 citations), Electrical and Electronic Engineering (445 citations), Automotive Engineering (86 citations), Industrial and Manufacturing Engineering (35 citations) and Computer Networks and Communications (79 citations). Bill Eklow has collaborated with scholars based in United States, China and Hong Kong. Frequent co-authors include Li Jiang, Qiang Xu, Krishnendu Chakrabarty, Jeff Rearick, Xinli Gu, Alfred L. Crouch, C. Barnhart, Huiyun Li, Fangming Ye and Ran Wang. Their work appears in journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Proceedings Design, Automation and Test in Europe Conference and Exhibition, Design, Automation, and Test in Europe, IEEE Design & Test of Computers and Lund University Publications (Lund University).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.