IEEE Transactions on Electronics Packaging Manufacturing
About
The 449 papers published in IEEE Transactions on Electronics Packaging Manufacturing in the last decades have received a total of 7.9k indexed citations.
Papers published in IEEE Transactions on Electronics Packaging Manufacturing usually cover Electrical and Electronic Engineering (325 papers), Mechanical Engineering (120 papers) and Industrial and Manufacturing Engineering (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (230 papers), 3D IC and TSV technologies (154 papers) and Manufacturing Process and Optimization (47 papers). The most active scholars publishing in IEEE Transactions on Electronics Packaging Manufacturing are Wayne Johnson, Michael Pecht, Kyung‐Wook Paik, C.P. Wong and D.F. Baldwin.
In The Last Decade
Explore journals with similar magnitude of impact
Top fields papers in Research Involvement and Engagement are covering Top countries impacted by papers in Educational Assessment Evaluation and Accountability Top countries impacted by papers in The Lancet Rheumatology Top fields papers in International Journal of Corpus Linguistics are covering Top journals impacted by papers in Antibodies Top countries impacted by papers in Mind Brain and Education Top countries impacted by papers in Stroke and Vascular Neurology Top fields papers in International Journal of Genomics are covering