Advanced Semiconductor Engineering (Taiwan)
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 523
- 3D IC and TSV technologies 446
- Electromagnetic Compatibility and Noise Suppression 122
- Integrated Circuits and Semiconductor Failure Analysis 81
- Microwave Engineering and Waveguides 63
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- Copper Interconnects and Reliability 98
- Top scholars
- Yi‐Shao LaiChang-Lin YehYi-Shao LaiPing‐Feng YangTong Hong WangChin-Li KaoC. R. KaoSheng‐Rui Jian
- Journals
- Microelectronics Reliability (65 papers)Journal of Electronic Materials (26 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (16 papers)Journal of Electronic Packaging (11 papers)Journal of Applied Physics (11 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Advanced Semiconductor Engineering (Taiwan)
889 papers receiving 10.7k citations
Peers
Comparison fields: 5 of 172
- Electrical and Electronic Engineering 7.9k
- Electronic, Optical and Magnetic Materials 1.7k
- Mechanical Engineering 2.7k
- Mechanics of Materials 1.6k
- General Materials Science 135
Countries citing scholars working at Advanced Semiconductor Engineering (Taiwan)
This map shows the geographic impact of research produced by authors working at Advanced Semiconductor Engineering (Taiwan). It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers produced at Advanced Semiconductor Engineering (Taiwan) with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Advanced Semiconductor Engineering (Taiwan) more than expected).
Fields of papers published by authors at Advanced Semiconductor Engineering (Taiwan)
This network shows the impact of papers affiliated with Advanced Semiconductor Engineering (Taiwan) at the time of their publication. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers affiliated with Advanced Semiconductor Engineering (Taiwan) at the time of their publication.
About Advanced Semiconductor Engineering (Taiwan)
In recent decades, authors affiliated with Advanced Semiconductor Engineering (Taiwan) have published 997 papers, which have received a total of 10.9k indexed citations . Scholars at this organization have produced 808 papers in Electrical and Electronic Engineering, 122 papers in Electronic, Optical and Magnetic Materials, 125 papers in Mechanics of Materials, 31 papers in Hardware and Architecture and 169 papers in Mechanical Engineering on the topics of Electronic Packaging and Soldering Technologies (523 papers), 3D IC and TSV technologies (446 papers), Electromagnetic Compatibility and Noise Suppression (122 papers), Copper Interconnects and Reliability (98 papers), Integrated Circuits and Semiconductor Failure Analysis (81 papers), Microwave Engineering and Waveguides (63 papers), Metal and Thin Film Mechanics (47 papers) and Advanced Surface Polishing Techniques (47 papers). Their work is cited by papers focused on Electrical and Electronic Engineering (7.9k citations), Electronic, Optical and Magnetic Materials (1.7k citations), Mechanical Engineering (2.7k citations), Mechanics of Materials (1.6k citations) and General Materials Science (135 citations). Authors at Advanced Semiconductor Engineering (Taiwan) collaborate with scholars in Taiwan, United States and China and have published in prestigious journals including Microelectronics Reliability, Journal of Electronic Materials, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging and Journal of Applied Physics. Some of Advanced Semiconductor Engineering (Taiwan)'s most productive authors include Yi‐Shao Lai, Chang-Lin Yeh, Yi-Shao Lai, Ping‐Feng Yang, Tong Hong Wang, Chin-Li Kao, C. R. Kao, Sheng‐Rui Jian, K. N. Tu and Jiunn Chen.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.