Shouxu Wang
Impact in
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- Copper Interconnects and Reliability
- Polymers and Plastics top 5%
- Conducting polymers and applications
Papers in
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- Electrodeposition and Electroless Coatings 35
- Electronic Packaging and Soldering Technologies 29
- Nanomaterials and Printing Technologies 15
- 3D IC and TSV technologies 13
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- Advanced Sensor and Energy Harvesting Materials 17
- Co-authors
- Wei He (83 shared papers)Guoyun Zhou (60 shared papers)Yuanming Chen (69 shared papers)Chong Wang (43 shared papers)Yan Hong (43 shared papers)Zhihua Tao (9 shared papers)Yao Tang (7 shared papers)Xian‐Wu Bi (2 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (11 papers)Applied Surface Science (9 papers)Journal of the Taiwan Institute of Chemical Engineers (4 papers)Electrochimica Acta (4 papers)Journal of The Electrochemical Society (4 papers)
- Partner nations
- ChinaUnited KingdomUnited States
In The Last Decade
Shouxu Wang
97 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 81
- Electronic, Optical and Magnetic Materials 409
- Polymers and Plastics 284
- Electrochemistry 114
- Electrical and Electronic Engineering 1.0k
- Geophysics 215
Countries citing papers authored by Shouxu Wang
This map shows the geographic impact of Shouxu Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shouxu Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shouxu Wang more than expected).
Fields of papers citing papers by Shouxu Wang
This network shows the impact of papers produced by Shouxu Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shouxu Wang. The network helps show where Shouxu Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Shouxu Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 99 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 100 | |
| 2 | 2018 | 95 | |
| 3 | 2014 | 88 | |
| 4 | 2018 | 83 | |
| 5 | 2014 | 79 | |
| 6 | 2018 | 75 | |
| 7 | 2020 | 70 | |
| 8 | 2013 | 69 | |
| 9 | 2022 | 56 | |
| 10 | 2020 | 55 | |
| 11 | 2020 | 51 | |
| 12 | 2015 | 48 | |
| 13 | 2019 | 40 | |
| 14 | 2016 | 36 | |
| 15 | 2014 | 32 | |
| 16 | 2018 | 31 | |
| 17 | 2011 | 30 | |
| 18 | 2017 | 30 | |
| 19 | 2020 | 27 | |
| 20 | 2016 | 26 |
About Shouxu Wang
Shouxu Wang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Polymers and Plastics, having authored 99 papers that have together received 1.8k indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (35 papers), Electronic Packaging and Soldering Technologies (29 papers), Conducting polymers and applications (18 papers), Advanced Sensor and Energy Harvesting Materials (17 papers), Corrosion Behavior and Inhibition (16 papers), Nanomaterials and Printing Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (11 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (409 citations), Polymers and Plastics (284 citations), Electrochemistry (114 citations), Electrical and Electronic Engineering (1.0k citations) and Geophysics (215 citations). Shouxu Wang has collaborated with scholars based in China, United Kingdom and United States. Frequent co-authors include Wei He, Guoyun Zhou, Yuanming Chen, Chong Wang, Yan Hong, Zhihua Tao, Yao Tang, Xian‐Wu Bi, Zhiqiang Lai and Cheng‐Biao Leng. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Applied Surface Science, Journal of the Taiwan Institute of Chemical Engineers, Electrochimica Acta and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.