Wei He
Impact in
- Metals and Alloys top 2%
- Polymers and Plastics top 5%
- Conducting polymers and applications
Papers in
-
- Electrodeposition and Electroless Coatings 53
- Electronic Packaging and Soldering Technologies 39
- Nanomaterials and Printing Technologies 19
- 3D IC and TSV technologies 18
-
- Corrosion Behavior and Inhibition 36
- Co-authors
- Shouxu Wang (83 shared papers)Guoyun Zhou (67 shared papers)Yuanming Chen (78 shared papers)Chong Wang (52 shared papers)Zhihua Tao (17 shared papers)Yan Hong (45 shared papers)Catherine Prentice (2 shared papers)Yongdong Shi (1 shared paper)
- Journals
- Journal of Materials Science Materials in Electronics (11 papers)Applied Surface Science (8 papers)Journal of The Electrochemical Society (6 papers)Journal of the Taiwan Institute of Chemical Engineers (5 papers)ACS Applied Materials & Interfaces (5 papers)
- Partner nations
- ChinaUnited StatesUnited Kingdom
In The Last Decade
Wei He
170 papers receiving 2.5k citations
Wei He's Hit Papers
Peers
Comparison fields: 5 of 121
- Metals and Alloys 190
- Polymers and Plastics 392
- Electrical and Electronic Engineering 1.5k
- Electronic, Optical and Magnetic Materials 439
- Electrochemistry 146
Countries citing papers authored by Wei He
This map shows the geographic impact of Wei He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei He more than expected).
Fields of papers citing papers by Wei He
This network shows the impact of papers produced by Wei He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei He. The network helps show where Wei He may publish in the future.
Co-authors
The 25 scholars most cited alongside Wei He, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 176 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 139 | |
| 2 | 2009 | 99 | |
| 3 | 2018 | 95 | |
| 4 | 2012 | 93 | |
| 5 | 2014 | 88 | |
| 6 | 2018 | 84 | |
| 7 | 2018 | 76 | |
| 8 | 2020 | 72 | |
| 9 | Insight into the anti-corrosion mechanism of crop waste Arachis hypogaea L. leaf extract for copper in sulfuric acid medium Hit paper breakdown → | 2024 | 72 |
| 10 | 2013 | 70 | |
| 11 | 2022 | 69 | |
| 12 | 2023 | 56 | |
| 13 | 2020 | 56 | |
| 14 | 2012 | 55 | |
| 15 | 2020 | 53 | |
| 16 | 2015 | 48 | |
| 17 | 2008 | 48 | |
| 18 | 2019 | 40 | |
| 19 | 2014 | 32 | |
| 20 | 2011 | 31 |
About Wei He
Wei He is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Polymers and Plastics and Electronic, Optical and Magnetic Materials, having authored 176 papers that have together received 2.6k indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (53 papers), Electronic Packaging and Soldering Technologies (39 papers), Corrosion Behavior and Inhibition (36 papers), Conducting polymers and applications (26 papers), Nanomaterials and Printing Technologies (19 papers), Advanced Sensor and Energy Harvesting Materials (18 papers), 3D IC and TSV technologies (18 papers) and Copper Interconnects and Reliability (14 papers). The work is most often cited by research in Metals and Alloys (190 citations), Polymers and Plastics (392 citations), Electrical and Electronic Engineering (1.5k citations), Electronic, Optical and Magnetic Materials (439 citations) and Electrochemistry (146 citations). Wei He has collaborated with scholars based in China, United States and United Kingdom. Frequent co-authors include Shouxu Wang, Guoyun Zhou, Yuanming Chen, Chong Wang, Zhihua Tao, Yan Hong, Catherine Prentice, Yongdong Shi, Yao Tang and Spyros Diplas. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Applied Surface Science, Journal of The Electrochemical Society, Journal of the Taiwan Institute of Chemical Engineers and ACS Applied Materials & Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.