Stan Tsai

595 citations
23 papers · 241 · h-index 10

Impact in

Papers in

    • Semiconductor materials and devices 6
    • Integrated Circuits and Semiconductor Failure Analysis 4
    • Advancements in Semiconductor Devices and Circuit Design 3
    • Electrodeposition and Electroless Coatings 3
    • Advanced Surface Polishing Techniques 14

Stan Tsai

22 papers receiving 223 citations

Peers

Stan Tsai
Comparison fields: 5 of 28
  • Biomedical Engineering 154
  • Electrical and Electronic Engineering 165
  • Electronic, Optical and Magnetic Materials 32
  • Mechanical Engineering 54
  • Orthodontics 5
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H. Yin United States
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J. Y. Wu Taiwan
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X. F. Ang Singapore
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Citations per field
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Citations per year

Countries citing papers authored by Stan Tsai

Since Specialization
Citations

This map shows the geographic impact of Stan Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Stan Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Stan Tsai more than expected).

Fields of papers citing papers by Stan Tsai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Stan Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Stan Tsai. The network helps show where Stan Tsai may publish in the future.

Co-authors

The 25 scholars most cited alongside Stan Tsai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Stan Tsai Line = papers co-authored together Stan Tsai links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.

#Work
1 199846
2 200640
3 201623
4 200418
5 201215
6 200215
7 200114
8 200312
9 200310
10 201710
11 20067
12 20125
13 20105
14 20054
15 20174
16 20074
17 20183
18 20102
19 19981
20 20031

About Stan Tsai

Stan Tsai is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Materials Chemistry, having authored 23 papers that have together received 241 indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (14 papers), Copper Interconnects and Reliability (7 papers), Semiconductor materials and devices (6 papers), Diamond and Carbon-based Materials Research (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Advanced machining processes and optimization (4 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers) and Electrodeposition and Electroless Coatings (3 papers). The work is most often cited by research in Biomedical Engineering (154 citations), Electrical and Electronic Engineering (165 citations), Electronic, Optical and Magnetic Materials (32 citations), Mechanical Engineering (54 citations) and Orthodontics (5 citations). Stan Tsai has collaborated with scholars based in United States, Germany and France. Frequent co-authors include Tianbao Du, Nicholas J. Mourlas, C.W. Storment, G.T.A. Kovacs, Thomas Kim, Samantha H. Tan, John Heck, Liang Chen, Lizhong Sun and Shijian Li. Their work appears in journals such as Ironmaking & Steelmaking Processes Products and Applications, Journal of The Electrochemical Society, Sensors and Actuators A Physical, ECS Transactions and MRS Advances.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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