Xiangdong Liu
About
Xiangdong Liu has authored 45 papers that have received a total of 1.1k indexed citations.
This includes 28 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 10 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (7 papers). Xiangdong Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (7 papers) and collaborates with scholars based in China, Japan and Singapore. Xiangdong Liu's co-authors include Hiroshi Nishikawa, Mingwen Zhao, Yueyuan Xia, Qingdong Xu and Pengcheng Zhang and has published in prestigious journals such as Scientific Reports, The Journal of Physical Chemistry C and IEEE Transactions on Industrial Electronics.
In The Last Decade
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Gordon F. Rushworth Breakdown of academic impact, for papers by Tunçalp Özgen Breakdown of academic impact, for papers by Yong Zou Breakdown of academic impact, for papers by Cristina Jommi Breakdown of academic impact, for papers by Katsuhiro Isozaki Breakdown of academic impact, for papers by Julie Wu Breakdown of academic impact, for papers by Zhihang Zhang Breakdown of academic impact, for papers by Andreas Winkelmann