S. Lipa
Impact in
- Hardware and Architecture top 10%
-
- Radio Frequency Integrated Circuit Design
- Advancements in PLL and VCO Technologies
- Low-power high-performance VLSI design
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
Papers in
-
- 3D IC and TSV technologies 9
- Semiconductor materials and devices 6
- VLSI and FPGA Design Techniques 6
- Low-power high-performance VLSI design 4
- Electromagnetic Compatibility and Noise Suppression 4
-
- Parallel Computing and Optimization Techniques 8
- Embedded Systems Design Techniques 5
- Co-authors
- John Wood (2 shared papers)Terry C. Edwards (1 shared paper)Paul D. Franzon (26 shared papers)M.B. Steer (9 shared papers)S. Hens (1 shared paper)Talmage Tyler (1 shared paper)O. Shenderova (1 shared paper)G. E. McGuire (1 shared paper)
- Journals
- IEEE Journal of Solid-State Circuits (1 paper)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (1 paper)Diamond and Related Materials (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (1 paper)
- Partner nations
- United StatesSwitzerlandGermany
In The Last Decade
S. Lipa
28 papers receiving 478 citations
Peers
Comparison fields: 5 of 40
- Hardware and Architecture 72
- Electrical and Electronic Engineering 370
- Materials Chemistry 122
- Computer Networks and Communications 54
- Polymers and Plastics 33
Countries citing papers authored by S. Lipa
This map shows the geographic impact of S. Lipa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Lipa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Lipa more than expected).
Fields of papers citing papers by S. Lipa
This network shows the impact of papers produced by S. Lipa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Lipa. The network helps show where S. Lipa may publish in the future.
Co-authors
The 25 scholars most cited alongside S. Lipa, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 224 | |
| 2 | 2007 | 112 | |
| 3 | 1995 | 31 | |
| 4 | 2008 | 20 | |
| 5 | 2013 | 16 | |
| 6 | 2003 | 16 | |
| 7 | 2002 | 10 | |
| 8 | 2004 | 9 | |
| 9 | 2021 | 9 | |
| 10 | 2012 | 8 | |
| 11 | 2002 | 6 | |
| 12 | 2022 | 5 | |
| 13 | 2015 | 5 | |
| 14 | 1993 | 4 | |
| 15 | 1996 | 4 | |
| 16 | 2014 | 3 | |
| 17 | 2016 | 3 | |
| 18 | 2017 | 3 | |
| 19 | 2002 | 3 | |
| 20 | 2013 | 2 |
About S. Lipa
S. Lipa is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Automotive Engineering and Materials Chemistry, having authored 29 papers that have together received 501 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Parallel Computing and Optimization Techniques (8 papers), Interconnection Networks and Systems (7 papers), Semiconductor materials and devices (6 papers), VLSI and FPGA Design Techniques (6 papers), Embedded Systems Design Techniques (5 papers), Low-power high-performance VLSI design (4 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). The work is most often cited by research in Hardware and Architecture (72 citations), Electrical and Electronic Engineering (370 citations), Materials Chemistry (122 citations), Computer Networks and Communications (54 citations) and Polymers and Plastics (33 citations). S. Lipa has collaborated with scholars based in United States, Switzerland and Germany. Frequent co-authors include John Wood, Terry C. Edwards, Paul D. Franzon, M.B. Steer, S. Hens, Talmage Tyler, O. Shenderova, G. E. McGuire, John R. Walsh and В. Л. Кузнецов. Their work appears in journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Diamond and Related Materials, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and IEEE Transactions on Components Hybrids and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.