Robert Patti
Impact in
- Hardware and Architecture top 5%
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Memory and Neural Computing
- Advancements in Photolithography Techniques
Papers in
-
- 3D IC and TSV technologies 11
- Photonic and Optical Devices 7
- Semiconductor Lasers and Optical Devices 6
- Semiconductor materials and devices 4
- Optical Network Technologies 3
- Advanced Photonic Communication Systems 3
- Electronic Packaging and Soldering Technologies 2
- Co-authors
- Roshan Weerasekera (2 shared papers)Trevor Mudge (1 shared paper)Bharan Giridhar (1 shared paper)Ronald Dreslinski (1 shared paper)David T. Blaauw (1 shared paper)Chaitali Chakrabarti (1 shared paper)En‐Xiao Liu (1 shared paper)Yuanming Zhu (6 shared papers)
- Journals
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems (1 paper)Journal of Lightwave Technology (1 paper)IEEE Solid-State Circuits Letters (1 paper)IEEE Transactions on Electron Devices (1 paper)Proceedings of the IEEE (1 paper)
- Partner nations
- United StatesSingaporePoland
In The Last Decade
Robert Patti
18 papers receiving 662 citations
Robert Patti's Hit Papers
Peers
Comparison fields: 5 of 38
- Hardware and Architecture 120
- Electrical and Electronic Engineering 619
- Automotive Engineering 79
- Computer Networks and Communications 137
- Nuclear and High Energy Physics 40
Countries citing papers authored by Robert Patti
This map shows the geographic impact of Robert Patti's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Patti with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Patti more than expected).
Fields of papers citing papers by Robert Patti
This network shows the impact of papers produced by Robert Patti. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Patti. The network helps show where Robert Patti may publish in the future.
Co-authors
The 25 scholars most cited alongside Robert Patti, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs Hit paper breakdown → | 2006 | 494 |
| 2 | 2013 | 50 | |
| 3 | 2012 | 27 | |
| 4 | 2023 | 27 | |
| 5 | 2015 | 26 | |
| 6 | 2011 | 13 | |
| 7 | 2010 | 8 | |
| 8 | 2018 | 7 | |
| 9 | 2012 | 6 | |
| 10 | 2022 | 6 | |
| 11 | 2019 | 5 | |
| 12 | 2017 | 4 | |
| 13 | 2023 | 4 | |
| 14 | 2010 | 4 | |
| 15 | 2023 | 3 | |
| 16 | 2023 | 3 | |
| 17 | 2024 | 1 | |
| 18 | 2023 | 1 | |
| 19 | 3D integrated circuits: Designing in a new dimension: Designer track | 2012 | 0 |
| 20 | 2014 | 0 |
About Robert Patti
Robert Patti is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Nuclear and High Energy Physics, Atomic and Molecular Physics, and Optics and Industrial and Manufacturing Engineering, having authored 23 papers that have together received 689 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Photonic and Optical Devices (7 papers), Semiconductor Lasers and Optical Devices (6 papers), Semiconductor materials and devices (4 papers), Optical Network Technologies (3 papers), Advanced Photonic Communication Systems (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Particle Detector Development and Performance (2 papers). The work is most often cited by research in Hardware and Architecture (120 citations), Electrical and Electronic Engineering (619 citations), Automotive Engineering (79 citations), Computer Networks and Communications (137 citations) and Nuclear and High Energy Physics (40 citations). Robert Patti has collaborated with scholars based in United States, Singapore and Poland. Frequent co-authors include Roshan Weerasekera, Trevor Mudge, Bharan Giridhar, Ronald Dreslinski, David T. Blaauw, Chaitali Chakrabarti, En‐Xiao Liu, Yuanming Zhu, P.M. Enquist and Gabriella A. Carini. Their work appears in journals such as IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Journal of Lightwave Technology, IEEE Solid-State Circuits Letters, IEEE Transactions on Electron Devices and Proceedings of the IEEE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.