Peter Elenius
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 28
- 3D IC and TSV technologies 1
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- Copper Interconnects and Reliability 1
- Co-authors
- Haluk Balkan (5 shared papers)Everett C. C. Yeh (2 shared papers)K. N. Tu (1 shared paper)K. N. Tu (3 shared papers)C. Y. Liu (1 shared paper)Tan Tsu Sheng (1 shared paper)D. R. Frear (1 shared paper)M. Li (1 shared paper)
- Journals
- Journal of materials research/Pratt's guide to venture capital sources (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Applied Physics Letters (1 paper)Journal of Applied Physics (1 paper)Microelectronics Reliability (1 paper)
- Partner nations
- United StatesSwedenSingapore
In The Last Decade
Peter Elenius
25 papers receiving 698 citations
Peter Elenius's Hit Papers
Peers
Comparison fields: 5 of 19
- Electrical and Electronic Engineering 727
- Electronic, Optical and Magnetic Materials 46
- General Materials Science 7
- Safety, Risk, Reliability and Quality 3
- Computational Mechanics 5
Countries citing papers authored by Peter Elenius
This map shows the geographic impact of Peter Elenius's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Elenius with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Elenius more than expected).
Fields of papers citing papers by Peter Elenius
This network shows the impact of papers produced by Peter Elenius. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Elenius. The network helps show where Peter Elenius may publish in the future.
Co-authors
The 20 scholars most cited alongside Peter Elenius, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Current-crowding-induced electromigration failure in flip chip solder joints Hit paper breakdown → | 2002 | 318 |
| 2 | 2000 | 105 | |
| 3 | 2002 | 77 | |
| 4 | 2003 | 35 | |
| 5 | 2002 | 33 | |
| 6 | 2000 | 28 | |
| 7 | Wafer bumping technologies-A comparative analysis of solder deposition processes and assembly considerations. | 1997 | 23 |
| 8 | 2003 | 22 | |
| 9 | 2002 | 15 | |
| 10 | 2002 | 14 | |
| 11 | 2003 | 14 | |
| 12 | 2003 | 14 | |
| 13 | 2003 | 13 | |
| 14 | 2002 | 9 | |
| 15 | 2002 | 7 | |
| 16 | 2002 | 7 | |
| 17 | 2003 | 7 | |
| 18 | 1999 | 4 | |
| 19 | 2002 | 4 | |
| 20 | 2002 | 4 |
About Peter Elenius
Peter Elenius is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Nuclear Energy and Engineering, Waste Management and Disposal and Infectious Diseases, having authored 28 papers that have together received 766 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (28 papers), Copper Interconnects and Reliability (1 paper) and 3D IC and TSV technologies (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (727 citations), Electronic, Optical and Magnetic Materials (46 citations), General Materials Science (7 citations), Safety, Risk, Reliability and Quality (3 citations) and Computational Mechanics (5 citations). Peter Elenius has collaborated with scholars based in United States, Sweden and Singapore. Frequent co-authors include Haluk Balkan, Everett C. C. Yeh, K. N. Tu, K. N. Tu, C. Y. Liu, Tan Tsu Sheng, D. R. Frear, M. Li, Masamoto Tanaka and R. A. Augur. Their work appears in journals such as Journal of materials research/Pratt's guide to venture capital sources, IEEE Transactions on Electronics Packaging Manufacturing, Applied Physics Letters, Journal of Applied Physics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.