Ming-Tzer Lin
Impact in
- Condensed Matter Physics top 10%
- GaN-based semiconductor devices and materials
- Mechanics of Materials top 10%
- Metal and Thin Film Mechanics
Papers in
-
- Electronic Packaging and Soldering Technologies 13
- Advanced MEMS and NEMS Technologies 7
- 3D IC and TSV technologies 6
-
- Metal and Thin Film Mechanics 27
- Co-authors
- W. L. Brown (4 shared papers)Richard P. Vinci (4 shared papers)Zhaoying Wang (5 shared papers)T. J. Delph (3 shared papers)Richard R. Chromik (3 shared papers)Chih‐Ming Chen (2 shared papers)Ray‐Hua Horng (3 shared papers)Chao-hong Wang (1 shared paper)
- Journals
- Microsystem Technologies (11 papers)Surface and Coatings Technology (4 papers)Thin Solid Films (4 papers)Journal of Electronic Materials (3 papers)Microelectronics Reliability (3 papers)
- Partner nations
- TaiwanUnited StatesVietnam
In The Last Decade
Ming-Tzer Lin
67 papers receiving 634 citations
Peers
Comparison fields: 5 of 69
- Condensed Matter Physics 101
- Mechanics of Materials 182
- Mechanical Engineering 237
- Electronic, Optical and Magnetic Materials 91
- Electrical and Electronic Engineering 258
Countries citing papers authored by Ming-Tzer Lin
This map shows the geographic impact of Ming-Tzer Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming-Tzer Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming-Tzer Lin more than expected).
Fields of papers citing papers by Ming-Tzer Lin
This network shows the impact of papers produced by Ming-Tzer Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming-Tzer Lin. The network helps show where Ming-Tzer Lin may publish in the future.
Co-authors
The 25 scholars most cited alongside Ming-Tzer Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 69 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 125 | |
| 2 | 2018 | 63 | |
| 3 | 2015 | 25 | |
| 4 | 2016 | 24 | |
| 5 | 2006 | 23 | |
| 6 | 2017 | 21 | |
| 7 | 2009 | 20 | |
| 8 | 2016 | 20 | |
| 9 | 2022 | 18 | |
| 10 | 2011 | 18 | |
| 11 | 2022 | 12 | |
| 12 | 2020 | 11 | |
| 13 | 2009 | 11 | |
| 14 | 2021 | 11 | |
| 15 | 2008 | 11 | |
| 16 | 2007 | 11 | |
| 17 | 2012 | 11 | |
| 18 | 2023 | 10 | |
| 19 | 2007 | 10 | |
| 20 | 2001 | 10 |
About Ming-Tzer Lin
Ming-Tzer Lin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 69 papers that have together received 649 indexed citations. Recurring topics across this work include Metal and Thin Film Mechanics (27 papers), Copper Interconnects and Reliability (20 papers), Advanced Surface Polishing Techniques (14 papers), Electronic Packaging and Soldering Technologies (13 papers), Advanced MEMS and NEMS Technologies (7 papers), Force Microscopy Techniques and Applications (6 papers), 3D IC and TSV technologies (6 papers) and Heat Transfer and Optimization (6 papers). The work is most often cited by research in Condensed Matter Physics (101 citations), Mechanics of Materials (182 citations), Mechanical Engineering (237 citations), Electronic, Optical and Magnetic Materials (91 citations) and Electrical and Electronic Engineering (258 citations). Ming-Tzer Lin has collaborated with scholars based in Taiwan, United States and Vietnam. Frequent co-authors include W. L. Brown, Richard P. Vinci, Zhaoying Wang, T. J. Delph, Richard R. Chromik, Chih‐Ming Chen, Ray‐Hua Horng, Chao-hong Wang, Wen‐Yen Lin and Chi-Ming Lai. Their work appears in journals such as Microsystem Technologies, Surface and Coatings Technology, Thin Solid Films, Journal of Electronic Materials and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.