Michael David Hook
About
Michael David Hook has authored 11 papers that have received a total of 1.4k indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 3 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (3 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). Michael David Hook is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (3 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers) and collaborates with scholars based in Canada, United States and South Korea. Michael David Hook's co-authors include M. Mayer, Di Xu, A. A. Burkov, Boxin Zhao and Y. Zhou and has published in prestigious journals such as Physical Review B, Journal of Alloys and Compounds and Nanotechnology.
In The Last Decade
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Matteo Giannetti Breakdown of academic impact, for papers by Marie-Claire Gensac Breakdown of academic impact, for papers by Elad Bassat Breakdown of academic impact, for papers by Saray Quintero-Fabián Breakdown of academic impact, for papers by M. M. Kini Breakdown of academic impact, for papers by Aida Cremesti Breakdown of academic impact, for papers by Stephanie J. Fertig Breakdown of academic impact, for papers by D. L. Carpenter