Di Xu
Impact in
- Ceramics and Composites top 10%
-
- Copper Interconnects and Reliability
Papers in
-
- Electronic Packaging and Soldering Technologies 13
- 3D IC and TSV technologies 8
- Electrodeposition and Electroless Coatings 4
-
- Microstructure and mechanical properties 7
- Co-authors
- K. N. Tu (6 shared papers)Vidvuds Ozoliņš (3 shared papers)M. Mayer (12 shared papers)Xiangfeng Duan (1 shared paper)Hua Zhang (1 shared paper)Yu Huang (1 shared paper)Xiang‐Yun Guo (1 shared paper)Qing Wang (1 shared paper)
- Journals
- Journal of Alloys and Compounds (2 papers)Journal of Applied Physics (2 papers)Electronic Materials Letters (2 papers)Solar Energy (2 papers)Microelectronics Reliability (2 papers)
- Partner nations
- ChinaUnited StatesCanada
In The Last Decade
Di Xu
42 papers receiving 923 citations
Peers
Comparison fields: 5 of 69
- Ceramics and Composites 73
- Electronic, Optical and Magnetic Materials 203
- Materials Chemistry 477
- Electrical and Electronic Engineering 497
- Polymers and Plastics 97
Countries citing papers authored by Di Xu
This map shows the geographic impact of Di Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Di Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Di Xu more than expected).
Fields of papers citing papers by Di Xu
This network shows the impact of papers produced by Di Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Di Xu. The network helps show where Di Xu may publish in the future.
Co-authors
The 25 scholars most cited alongside Di Xu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 140 | |
| 2 | 2007 | 94 | |
| 3 | 2010 | 82 | |
| 4 | 2009 | 76 | |
| 5 | 2008 | 57 | |
| 6 | 2018 | 44 | |
| 7 | 2005 | 43 | |
| 8 | 2015 | 34 | |
| 9 | 2015 | 31 | |
| 10 | 2008 | 30 | |
| 11 | 2013 | 30 | |
| 12 | 2005 | 24 | |
| 13 | 2021 | 17 | |
| 14 | 2018 | 16 | |
| 15 | 2017 | 16 | |
| 16 | 2014 | 16 | |
| 17 | 2004 | 15 | |
| 18 | 2019 | 15 | |
| 19 | 2013 | 14 | |
| 20 | 2017 | 13 |
About Di Xu
Di Xu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Polymers and Plastics, having authored 43 papers that have together received 935 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (9 papers), 3D IC and TSV technologies (8 papers), Microstructure and mechanical properties (7 papers), TiO2 Photocatalysis and Solar Cells (5 papers), Advanced Photocatalysis Techniques (4 papers), Conducting polymers and applications (4 papers) and Electrodeposition and Electroless Coatings (4 papers). The work is most often cited by research in Ceramics and Composites (73 citations), Electronic, Optical and Magnetic Materials (203 citations), Materials Chemistry (477 citations), Electrical and Electronic Engineering (497 citations) and Polymers and Plastics (97 citations). Di Xu has collaborated with scholars based in China, United States and Canada. Frequent co-authors include K. N. Tu, Vidvuds Ozoliņš, M. Mayer, Xiangfeng Duan, Hua Zhang, Yu Huang, Xiang‐Yun Guo, Qing Wang, Yajuan Hao and Guoqiang Jin. Their work appears in journals such as Journal of Alloys and Compounds, Journal of Applied Physics, Electronic Materials Letters, Solar Energy and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.