Michael D. Osterman
Impact in
- Automotive Engineering top 0.5%
- Advanced Battery Technologies Research
-
- Reliability and Maintenance Optimization
Papers in
-
- Electronic Packaging and Soldering Technologies 95
- 3D IC and TSV technologies 48
- Integrated Circuits and Semiconductor Failure Analysis 18
- Semiconductor materials and devices 9
-
- Advanced Welding Techniques Analysis 17
- Co-authors
- Michael Gerard Pecht (102 shared papers)Nicholas Williard (6 shared papers)Wei He (2 shared papers)Haiyu Qi (9 shared papers)Abhijit Dasgupta (13 shared papers)Bhanu Sood (6 shared papers)Yunhan Huang (2 shared papers)Arvind Sai Sarathi Vasan (2 shared papers)
- Journals
- IEEE Transactions on Device and Materials Reliability (12 papers)Journal of Electronic Materials (9 papers)Microelectronics Reliability (8 papers)IEEE Transactions on Components and Packaging Technologies (7 papers)Journal of Electronic Packaging (5 papers)
- Partner nations
- United StatesHong KongJapan
In The Last Decade
Michael D. Osterman
135 papers receiving 2.8k citations
Michael D. Osterman's Hit Papers
Peers
Comparison fields: 5 of 77
- Automotive Engineering 1.1k
- Safety, Risk, Reliability and Quality 524
- Electrical and Electronic Engineering 2.1k
- Control and Systems Engineering 444
- Mechanical Engineering 635
Countries citing papers authored by Michael D. Osterman
This map shows the geographic impact of Michael D. Osterman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael D. Osterman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael D. Osterman more than expected).
Fields of papers citing papers by Michael D. Osterman
This network shows the impact of papers produced by Michael D. Osterman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael D. Osterman. The network helps show where Michael D. Osterman may publish in the future.
Co-authors
The 25 scholars most cited alongside Michael D. Osterman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 142 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Prognostics of lithium-ion batteries based on Dempster–Shafer theory and the Bayesian Monte Carlo method Hit paper breakdown → | 2011 | 898 |
| 2 | 2012 | 165 | |
| 3 | 2020 | 77 | |
| 4 | 2015 | 72 | |
| 5 | 2011 | 58 | |
| 6 | 2011 | 53 | |
| 7 | 2008 | 53 | |
| 8 | 2006 | 53 | |
| 9 | 2005 | 49 | |
| 10 | 2013 | 48 | |
| 11 | 2009 | 46 | |
| 12 | 2009 | 44 | |
| 13 | 2008 | 43 | |
| 14 | 2009 | 38 | |
| 15 | 2014 | 37 | |
| 16 | 2011 | 35 | |
| 17 | 1989 | 33 | |
| 18 | 1990 | 33 | |
| 19 | 2012 | 31 | |
| 20 | 2004 | 30 |
About Michael D. Osterman
Michael D. Osterman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 142 papers that have together received 2.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (48 papers), Integrated Circuits and Semiconductor Failure Analysis (18 papers), Advanced Welding Techniques Analysis (17 papers), Advanced Battery Technologies Research (14 papers), Aluminum Alloy Microstructure Properties (11 papers), Manufacturing Process and Optimization (11 papers) and Semiconductor materials and devices (9 papers). The work is most often cited by research in Automotive Engineering (1.1k citations), Safety, Risk, Reliability and Quality (524 citations), Electrical and Electronic Engineering (2.1k citations), Control and Systems Engineering (444 citations) and Mechanical Engineering (635 citations). Michael D. Osterman has collaborated with scholars based in United States, Hong Kong and Japan. Frequent co-authors include Michael Gerard Pecht, Nicholas Williard, Wei He, Haiyu Qi, Abhijit Dasgupta, Bhanu Sood, Yunhan Huang, Arvind Sai Sarathi Vasan, Sony Mathew and Diganta Das. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Journal of Electronic Materials, Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.