Max Poech
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Multilevel Inverters and Converters
- Advanced DC-DC Converters
- Semiconductor materials and devices
- Electrostatic Discharge in Electronics
- Silicon and Solar Cell Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 7
- Silicon Carbide Semiconductor Technologies 4
- 3D IC and TSV technologies 3
- Silicon and Solar Cell Technologies 1
- Advanced DC-DC Converters 1
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- Metallurgy and Material Forming 1
- Co-authors
- Martin Held (2 shared papers)P. Jacob (2 shared papers)G. Nicoletti (2 shared papers)J.K. Kivilahti (1 shared paper)T. Reinikainen (1 shared paper)Martin Becker (1 shared paper)F. Wulff (1 shared paper)Lars Jensen (1 shared paper)
- Journals
- Journal of Electronic Packaging (1 paper)Microelectronics Reliability (1 paper)International Journal of Electronics (1 paper)MRS Proceedings (1 paper)Fraunhofer-Publica (Fraunhofer-Gesellschaft) (2 papers)
- Partner nations
- GermanyFinlandSwitzerland
In The Last Decade
Max Poech
10 papers receiving 591 citations
Max Poech's Hit Papers
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 592
- Automotive Engineering 39
- Mechanical Engineering 106
- Control and Systems Engineering 42
- Safety, Risk, Reliability and Quality 15
Countries citing papers authored by Max Poech
This map shows the geographic impact of Max Poech's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Max Poech with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Max Poech more than expected).
Fields of papers citing papers by Max Poech
This network shows the impact of papers produced by Max Poech. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Max Poech. The network helps show where Max Poech may publish in the future.
Co-authors
The 13 scholars most cited alongside Max Poech, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Fast power cycling test of IGBT modules in traction application Hit paper breakdown → | 2002 | 483 |
| 2 | 1999 | 67 | |
| 3 | 1998 | 25 | |
| 4 | Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers | 2014 | 24 |
| 5 | 1995 | 8 | |
| 6 | Quality evaluation for silver sintering layers in power electronic modules | 2012 | 8 |
| 7 | 2000 | 7 | |
| 8 | How materials behaviour affects power electronics reliability | 2010 | 5 |
| 9 | Bottom up Research and Development for a Low-Voltage Three Level NPC Converter | 2015 | 3 |
| 10 | 2004 | 1 |
About Max Poech
Max Poech is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Control and Systems Engineering and Materials Chemistry, having authored 10 papers that have together received 631 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (7 papers), Silicon Carbide Semiconductor Technologies (4 papers), 3D IC and TSV technologies (3 papers), High voltage insulation and dielectric phenomena (2 papers), Advanced Welding Techniques Analysis (1 paper), Metallurgy and Material Forming (1 paper), Silicon and Solar Cell Technologies (1 paper) and Advanced DC-DC Converters (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (592 citations), Automotive Engineering (39 citations), Mechanical Engineering (106 citations), Control and Systems Engineering (42 citations) and Safety, Risk, Reliability and Quality (15 citations). Max Poech has collaborated with scholars based in Germany, Finland and Switzerland. Frequent co-authors include Martin Held, P. Jacob, G. Nicoletti, J.K. Kivilahti, T. Reinikainen, Martin Becker, F. Wulff, Lars Jensen, Lothar Schmidt and Klaus Kohlmann. Their work appears in journals such as Journal of Electronic Packaging, Microelectronics Reliability, International Journal of Electronics, MRS Proceedings and Fraunhofer-Publica (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.