M. Thoben
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Semiconductor materials and devices
- Silicon and Solar Cell Technologies
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
Papers in
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- Silicon Carbide Semiconductor Technologies 16
- Electronic Packaging and Soldering Technologies 8
- Electrostatic Discharge in Electronics 4
- Advanced DC-DC Converters 4
- Electromagnetic Compatibility and Noise Suppression 4
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- Induction Heating and Inverter Technology 4
- Aluminum Alloys Composites Properties 3
- Co-authors
- Josef Lutz (6 shared papers)Oliver Schilling (2 shared papers)G. Khatibi (7 shared papers)Jürgen Wilde (2 shared papers)Wang Guo-zhong (1 shared paper)Zhilin Cheng (1 shared paper)M. Lederer (5 shared papers)W. Blum (1 shared paper)
- Journals
- Microelectronics Reliability (6 papers)SAE technical papers on CD-ROM/SAE technical paper series (2 papers)IEEE Transactions on Advanced Packaging (1 paper)European Conference on Power Electronics and Applications (1 paper)
In The Last Decade
M. Thoben
26 papers receiving 539 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 520
- Mechanical Engineering 167
- Mechanics of Materials 75
- Automotive Engineering 31
- Ceramics and Composites 8
Countries citing papers authored by M. Thoben
This map shows the geographic impact of M. Thoben's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Thoben with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Thoben more than expected).
Fields of papers citing papers by M. Thoben
This network shows the impact of papers produced by M. Thoben. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Thoben. The network helps show where M. Thoben may publish in the future.
Co-authors
The 23 scholars most cited alongside M. Thoben, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 95 | |
| 2 | 2012 | 70 | |
| 3 | 2012 | 68 | |
| 4 | Lifetime calculation for power modules, application and theory of models and counting methods | 2011 | 45 |
| 5 | 2005 | 42 | |
| 6 | 2011 | 36 | |
| 7 | 2006 | 30 | |
| 8 | Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling | 2014 | 27 |
| 9 | 2014 | 25 | |
| 10 | 2013 | 19 | |
| 11 | 2011 | 15 | |
| 12 | Benefits of new CoolSiCTM MOSFET in HybridPACKTM Drive package for electrical drive train applications. | 2018 | 14 |
| 13 | 2010 | 13 | |
| 14 | First power cycling results of improved packaging technologies for hybrid electrical vehicle applications | 2010 | 12 |
| 15 | 2013 | 9 | |
| 16 | 1998 | 6 | |
| 17 | 2001 | 6 | |
| 18 | Robust Top Side Contact Technology on Power Semiconductors ¿ Results from the Public Funded Project `ProPower¿ | 2014 | 5 |
| 19 | Automotive Qualification Routines for Power Electronics Components in Electrified Powertrains | 2018 | 4 |
| 20 | 2012 | 4 |
About M. Thoben
M. Thoben is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Control and Systems Engineering and Mechanics of Materials, having authored 26 papers that have together received 559 indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers), Electrostatic Discharge in Electronics (4 papers), Advanced DC-DC Converters (4 papers), Induction Heating and Inverter Technology (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Aluminum Alloys Composites Properties (3 papers) and Electric and Hybrid Vehicle Technologies (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (520 citations), Mechanical Engineering (167 citations), Mechanics of Materials (75 citations), Automotive Engineering (31 citations) and Ceramics and Composites (8 citations). M. Thoben has collaborated with scholars based in Germany, Austria and Taiwan. Frequent co-authors include Josef Lutz, Oliver Schilling, G. Khatibi, Jürgen Wilde, Wang Guo-zhong, Zhilin Cheng, M. Lederer, W. Blum, Karl‐Friedrich Becker and Christian Herold. Their work appears in journals such as Microelectronics Reliability, SAE technical papers on CD-ROM/SAE technical paper series, IEEE Transactions on Advanced Packaging and European Conference on Power Electronics and Applications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.