T.H. Low
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Metal Forming Simulation Techniques
Papers in
-
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 10
- Integrated Circuits and Semiconductor Failure Analysis 4
-
- Metal Forming Simulation Techniques 2
- High Temperature Alloys and Creep 2
- Co-authors
- J.H.L. Pang (18 shared papers)B.S. Xiong (6 shared papers)Desmond Y. R. Chong (3 shared papers)Luhua Xu (1 shared paper)K. H. Prakash (2 shared papers)Fa Xing (7 shared papers)William Lee (1 shared paper)Anders Yeo (1 shared paper)
- Journals
- Thin Solid Films (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)
- Partner nations
- Singapore
In The Last Decade
T.H. Low
18 papers receiving 756 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 754
- Mechanical Engineering 436
- General Materials Science 24
- Aerospace Engineering 145
- Mechanics of Materials 123
Countries citing papers authored by T.H. Low
This map shows the geographic impact of T.H. Low's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.H. Low with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.H. Low more than expected).
Fields of papers citing papers by T.H. Low
This network shows the impact of papers produced by T.H. Low. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.H. Low. The network helps show where T.H. Low may publish in the future.
Co-authors
The 11 scholars most cited alongside T.H. Low, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 170 | |
| 2 | 2001 | 129 | |
| 3 | 2004 | 94 | |
| 4 | 2005 | 88 | |
| 5 | 2004 | 75 | |
| 6 | 2004 | 59 | |
| 7 | 2004 | 45 | |
| 8 | 2004 | 26 | |
| 9 | 2005 | 25 | |
| 10 | 2004 | 15 | |
| 11 | 2004 | 13 | |
| 12 | 2004 | 11 | |
| 13 | 2004 | 10 | |
| 14 | 2004 | 10 | |
| 15 | 2004 | 10 | |
| 16 | 2004 | 10 | |
| 17 | 2003 | 5 | |
| 18 | 2003 | 1 |
About T.H. Low
T.H. Low is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, Mechanics of Materials and Biomedical Engineering, having authored 18 papers that have together received 796 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (10 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Aluminum Alloy Microstructure Properties (3 papers), Metal Forming Simulation Techniques (2 papers), Fatigue and fracture mechanics (2 papers), Advanced Surface Polishing Techniques (2 papers) and High Temperature Alloys and Creep (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (754 citations), Mechanical Engineering (436 citations), General Materials Science (24 citations), Aerospace Engineering (145 citations) and Mechanics of Materials (123 citations). T.H. Low has collaborated with scholars based in Singapore. Frequent co-authors include J.H.L. Pang, B.S. Xiong, Desmond Y. R. Chong, Luhua Xu, K. H. Prakash, Fa Xing, Luhua Xu, William Lee, Anders Yeo and G.H. Lim. Their work appears in journals such as Thin Solid Films and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.