Linlin Cai
Impact in
- Soil Science top 5%
- Composting and Vermicomposting Techniques
-
- Constructed Wetlands for Wastewater Treatment
- Waste Management and Recycling
- Municipal Solid Waste Management
Papers in
-
- Semiconductor materials and devices 37
- Advancements in Semiconductor Devices and Circuit Design 27
- Ferroelectric and Negative Capacitance Devices 11
- Integrated Circuits and Semiconductor Failure Analysis 9
- Electronic Packaging and Soldering Technologies 5
- Soil Science 10
- Composting and Vermicomposting Techniques 9
- Co-authors
- Xiangyang Sun (8 shared papers)Suyan Li (9 shared papers)Wangyong Chen (44 shared papers)Xiaoqiang Gong (7 shared papers)Gang Du (16 shared papers)Xiaoyan Liu (15 shared papers)Xing Zhang (5 shared papers)Scott X. Chang (3 shared papers)
- Journals
- IEEE Transactions on Electron Devices (9 papers)Microelectronics Reliability (5 papers)IEEE Electron Device Letters (4 papers)IEEE Transactions on Device and Materials Reliability (2 papers)IEEE photonics journal (2 papers)
- Partner nations
- ChinaUnited StatesCanada
In The Last Decade
Linlin Cai
45 papers receiving 663 citations
Peers
Comparison fields: 5 of 81
- Soil Science 243
- Industrial and Manufacturing Engineering 128
- Pollution 71
- Electrical and Electronic Engineering 272
- Plant Science 94
Countries citing papers authored by Linlin Cai
This map shows the geographic impact of Linlin Cai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Linlin Cai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Linlin Cai more than expected).
Fields of papers citing papers by Linlin Cai
This network shows the impact of papers produced by Linlin Cai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Linlin Cai. The network helps show where Linlin Cai may publish in the future.
Co-authors
The 25 scholars most cited alongside Linlin Cai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 58 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 85 | |
| 2 | 2018 | 81 | |
| 3 | 2018 | 80 | |
| 4 | 2018 | 63 | |
| 5 | 2018 | 38 | |
| 6 | 2019 | 32 | |
| 7 | 2018 | 23 | |
| 8 | 2018 | 21 | |
| 9 | 2020 | 19 | |
| 10 | 2022 | 19 | |
| 11 | 2018 | 18 | |
| 12 | 2024 | 17 | |
| 13 | 2019 | 17 | |
| 14 | 2018 | 17 | |
| 15 | 2023 | 16 | |
| 16 | 2021 | 15 | |
| 17 | 2023 | 9 | |
| 18 | 2018 | 8 | |
| 19 | 2019 | 7 | |
| 20 | 2023 | 7 |
About Linlin Cai
Linlin Cai is a scholar working on Electrical and Electronic Engineering, Soil Science, Electronic, Optical and Magnetic Materials, Materials Chemistry and Industrial and Manufacturing Engineering, having authored 58 papers that have together received 676 indexed citations. Recurring topics across this work include Semiconductor materials and devices (37 papers), Advancements in Semiconductor Devices and Circuit Design (27 papers), Ferroelectric and Negative Capacitance Devices (11 papers), Composting and Vermicomposting Techniques (9 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Copper Interconnects and Reliability (9 papers), Thermal properties of materials (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). The work is most often cited by research in Soil Science (243 citations), Industrial and Manufacturing Engineering (128 citations), Pollution (71 citations), Electrical and Electronic Engineering (272 citations) and Plant Science (94 citations). Linlin Cai has collaborated with scholars based in China, United States and Canada. Frequent co-authors include Xiangyang Sun, Suyan Li, Wangyong Chen, Xiaoqiang Gong, Gang Du, Xiaoyan Liu, Xing Zhang, Scott X. Chang, Xin Yu and Zhengfeng An. Their work appears in journals such as IEEE Transactions on Electron Devices, Microelectronics Reliability, IEEE Electron Device Letters, IEEE Transactions on Device and Materials Reliability and IEEE photonics journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.