Jesse Tice

1.5k citations
43 papers · 1.2k · h-index 19

Impact in

    • Advanced Memory and Neural Computing
    • Ferroelectric and Negative Capacitance Devices
    • Perovskite Materials and Applications
    • 2D Materials and Applications
    • ZnO doping and properties
    • MXene and MAX Phase Materials
    • Thermal properties of materials

Papers in

Jesse Tice

42 papers receiving 1.2k citations

Peers

Jesse Tice
Comparison fields: 5 of 69
  • Electrical and Electronic Engineering 757
  • Materials Chemistry 604
  • Structural Biology 15
  • Electronic, Optical and Magnetic Materials 167
  • Polymers and Plastics 125
Replace H. Kawaura with:
H. Kawaura Japan
Joon Young Kwak South Korea
Pradyumna L. Prabhumirashi United States
Roman Sordan Italy
Kuan Eng Johnson Goh Singapore
Sangsul Lee South Korea
Jinseong Heo South Korea
Sangheon Lee South Korea
О. А. Агеев Russia
Jabulani R. Barber United States
Jesse Tice relative to H. Kawaura Japan H. Kawaura's profile →
Citations per field
00.5×4.3×
H. Kawaura · 1×
Citations per year

Countries citing papers authored by Jesse Tice

Since Specialization
Citations

This map shows the geographic impact of Jesse Tice's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jesse Tice with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jesse Tice more than expected).

Fields of papers citing papers by Jesse Tice

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jesse Tice. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jesse Tice. The network helps show where Jesse Tice may publish in the future.

Co-authors

The 25 scholars most cited alongside Jesse Tice, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Jesse Tice Line = papers co-authored together Jesse Tice links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.

#Work
1 2018168
2 2017167
3 2018132
4 2017126
5 201762
6 201759
7 201849
8 201847
9 201845
10 201742
11 201841
12 202033
13 200727
14 200625
15 196324
16 200721
17 201721
18 201818
19 201718
20 201013

About Jesse Tice

Jesse Tice is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Aerospace Engineering, having authored 43 papers that have together received 1.2k indexed citations. Recurring topics across this work include Semiconductor materials and devices (9 papers), Nanomaterials and Printing Technologies (7 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Advanced Memory and Neural Computing (5 papers), Antenna Design and Analysis (4 papers), Semiconductor materials and interfaces (4 papers), Silicon Nanostructures and Photoluminescence (4 papers) and Advanced Sensor and Energy Harvesting Materials (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (757 citations), Materials Chemistry (604 citations), Structural Biology (15 citations), Electronic, Optical and Magnetic Materials (167 citations) and Polymers and Plastics (125 citations). Jesse Tice has collaborated with scholars based in United States, China and Israel. Frequent co-authors include Han Wang, Xiaodong Yan, Michael T. Barako, He Tian, Xing Lan, Ivan Sanchez Esqueda, Jiahui Ma, Jack C. Lee, Xiaohan Wu and Myungsoo Kim. Their work appears in journals such as Chemistry of Materials, Dalton Transactions, ACS Applied Materials & Interfaces, Journal of the American Chemical Society and IEEE Transactions on Components Packaging and Manufacturing Technology.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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