J. C. Bea

676 citations

53 papers · 548 · h-index 12

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies

Papers in

Electrical and Electronic Engineering 49
- 3D IC and TSV technologies 43
- Electronic Packaging and Soldering Technologies 21
- Semiconductor materials and devices 10
Biomedical Engineering 21
- Nanofabrication and Lithography Techniques 11
- Advanced Surface Polishing Techniques 8

Co-authors: Takafumi Fukushima (51 shared papers)Mitsumasa Koyanagi (46 shared papers)Tetsu Tanaka (38 shared papers)M. Murugesan (43 shared papers)Kangwook Lee (13 shared papers)Yuki Ohara (9 shared papers)Eiji Iwata (5 shared papers)Toshihiro Konno (3 shared papers)
Journals: IEEE Transactions on Electron Devices (5 papers)Applied Physics Letters (2 papers)Semiconductor Science and Technology (1 paper)IEEE Transactions on Semiconductor Manufacturing (1 paper)Japanese Journal of Applied Physics (1 paper)
Partner nations: Japan South Korea United States

In The Last Decade

J. C. Bea

51 papers receiving 540 citations

Peers

Countries citing papers authored by J. C. Bea

Since Specialization

Citations

This map shows the geographic impact of J. C. Bea's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. C. Bea with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. C. Bea more than expected).

Fields of papers citing papers by J. C. Bea

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. C. Bea. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. C. Bea. The network helps show where J. C. Bea may publish in the future.

Co-authors

The 25 scholars most cited alongside J. C. Bea, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. C. Bea Line = papers co-authored together J. C. Bea links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 53 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits Applied Physics Letters ·Takafumi Fukushima, Eiji Iwata, Toshihiro Konno, J. C. Bea, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2010	67
2	New heterogeneous multi-chip module integration technology using self-assembly method Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama, M. Murugesan, K. Sato, Wonbeen Jeong, Yuki Ohara, Akihiro Noriki, Shigenori Kanno, Yoshiyuki Kaiho, Hisashi Kino, Kikuo Makita, R. Kobayashi, Chun Yin, Kiyoshi Inamura, K.-W. Lee, J. C. Bea, Tetsu Tanaka, Mitsumasa Koyanagi	2008	45
3	Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film IEEE Transactions on Electron Devices ·Takafumi Fukushima, J. C. Bea, Hisashi Kino, C. Nagai, M. Murugesan, H. Hashiguchi, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2014	42
4	Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation IEEE Transactions on Electron Devices ·Takafumi Fukushima, Eiji Iwata, Yuki Ohara, M. Murugesan, J. C. Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2012	41
5	10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kangwook Lee, M. Murugesan, J. C. Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2009	37
6	Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing IEEE Transactions on Components Packaging and Manufacturing Technology ·Takafumi Fukushima, Eiji Iwata, Yuki Ohara, M. Murugesan, J. C. Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2011	36
7	New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding Takafumi Fukushima, H. Hashiguchi, J. C. Bea, Yuki Ohara, M. Murugesan, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2012	24
8	Minimizing the local deformation induced around Cu-TSVs and CuSn/InAu-microbumps in high-density 3D-LSIs M. Murugesan, Hiroshi Kobayashi, H. Shimamoto, Fumiaki Yamada, Takafumi Fukushima, J. C. Bea, K. W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2012	21
9	Magnetic properties of FePt nanodots formed by a self-assembled nanodot deposition method Applied Physics Letters ·Cheng-Kuan Yin, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, J. C. Bea, Heechul Choi, Masahiko Nishijima, Masanobu Miyao	2006	13
10	Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature Takafumi Fukushima, Eiji Iwata, J. C. Bea, M. Murugesan, K Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2010	12
11	Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration Takafumi Fukushima, Yuki Ohara, M. Murugesan, J. C. Bea, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2011	12
12	Highly beneficial organic liner with extremely low Thermal stress for fine Cu-TSV in 3D-integration M. Murugesan, Takafumi Fukushima, J. C. Bea, Yuichi Sato, Hiroyuki Hashimoto, K.W. Lee, Mitsumasa Koyanagi	2014	12
13	Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI Akihiro Noriki, Kangwook Lee, J. C. Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2010	11
14	Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy Journal of Applied Physics ·M. Murugesan, J. C. Bea, Cheng-Kuan Yin, Hiroshi Nohira, E. Ikenaga, Takanori Hattori, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Masanobu Miyao, Mitsumasa Koyanagi	2008	10
15	Mechanical Characteristics of Thin Die/Wafers in Three-Dimensional Large-Scale Integrated Systems IEEE Transactions on Semiconductor Manufacturing ·M. Murugesan, Takafumi Fukushima, J. C. Bea, Kang-Wook Lee, Mitsumasa Koyanagi	2014	10
16	Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM IEEE Transactions on Electron Devices ·Kangwook Lee, Seiya Tanikawa, M. Murugesan, Hideki Naganuma, J. C. Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2014	10
17	Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates M. Murugesan, J. C. Bea, Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama, Wonbeen Jeong, Hisashi Kino, Akihiro Noriki, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi	2009	10
18	Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV K.W. Lee, C. Nagai, Ai Nakamura, J. C. Bea, M. Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	2014	10
19	High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications Japanese Journal of Applied Physics ·M. Murugesan, K. Mori, J. C. Bea, Mitsumasa Koyanagi, Takafumi Fukushima	2020	10
20	High-step-coverage Cu-lateral interconnections over 100 µm thick chips on a polymer substrate—an alternative method to wire bonding Journal of Micromechanics and Microengineering ·M. Murugesan, Takafumi Fukushima, K. Kiyoyama, J. C. Bea, Tetsu Tanaka, Mitsumasa Koyanagi	2012	8

About J. C. Bea

J. C. Bea is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials, having authored 53 papers that have together received 548 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (21 papers), Nanofabrication and Lithography Techniques (11 papers), Modular Robots and Swarm Intelligence (11 papers), Semiconductor materials and devices (10 papers), Advanced Surface Polishing Techniques (8 papers), Copper Interconnects and Reliability (7 papers) and Semiconductor materials and interfaces (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (494 citations), Automotive Engineering (79 citations), Mechanical Engineering (164 citations), Biomedical Engineering (161 citations) and Electronic, Optical and Magnetic Materials (43 citations). J. C. Bea has collaborated with scholars based in Japan, South Korea and United States. Frequent co-authors include Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka, M. Murugesan, Kangwook Lee, Yuki Ohara, Eiji Iwata, Toshihiro Konno, Hisashi Kino and Akihiro Noriki. Their work appears in journals such as IEEE Transactions on Electron Devices, Applied Physics Letters, Semiconductor Science and Technology, IEEE Transactions on Semiconductor Manufacturing and Japanese Journal of Applied Physics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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