Hai Jun Ren
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Electrostatic Discharge in Electronics
- Advanced DC-DC Converters
- Semiconductor materials and devices
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- Aluminum Alloys Composites Properties
- Induction Heating and Inverter Technology
Papers in
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- Silicon Carbide Semiconductor Technologies 11
- Electromagnetic Compatibility and Noise Suppression 3
- Advanced Fiber Optic Sensors 2
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- Phase Change Materials Research 3
- Heat Transfer and Optimization 2
- Electrical Contact Performance and Analysis 2
- Co-authors
- Li Ran (11 shared papers)Wei Lai (4 shared papers)Philip Mawby (6 shared papers)Hui Li (5 shared papers)Ran Yao (3 shared papers)Olayiwola M. Alatise (2 shared papers)Borong Hu (3 shared papers)Zheng Zeng (3 shared papers)
- Journals
- IEEE Journal of Emerging and Selected Topics in Power Electronics (2 papers)IEEE Transactions on Electron Devices (2 papers)IEEE Transactions on Instrumentation and Measurement (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)International Journal of Heat and Mass Transfer (1 paper)
- Partner nations
- ChinaUnited Kingdom
In The Last Decade
Hai Jun Ren
14 papers receiving 387 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 335
- Mechanical Engineering 122
- Ceramics and Composites 18
- Automotive Engineering 30
- Control and Systems Engineering 46
Countries citing papers authored by Hai Jun Ren
This map shows the geographic impact of Hai Jun Ren's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hai Jun Ren with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hai Jun Ren more than expected).
Fields of papers citing papers by Hai Jun Ren
This network shows the impact of papers produced by Hai Jun Ren. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hai Jun Ren. The network helps show where Hai Jun Ren may publish in the future.
Co-authors
The 25 scholars most cited alongside Hai Jun Ren, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 159 | |
| 2 | 2019 | 57 | |
| 3 | 2018 | 48 | |
| 4 | 2021 | 23 | |
| 5 | 2020 | 22 | |
| 6 | 2021 | 19 | |
| 7 | 2021 | 18 | |
| 8 | 2018 | 13 | |
| 9 | 2019 | 10 | |
| 10 | 2020 | 8 | |
| 11 | 2022 | 8 | |
| 12 | 2017 | 5 | |
| 13 | 2020 | 4 | |
| 14 | 2016 | 3 |
About Hai Jun Ren
Hai Jun Ren is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Control and Systems Engineering and Ceramics and Composites, having authored 14 papers that have together received 397 indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (11 papers), Phase Change Materials Research (3 papers), Advanced Battery Technologies Research (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Heat Transfer and Optimization (2 papers), Advanced Fiber Optic Sensors (2 papers), Electrical Contact Performance and Analysis (2 papers) and Microgrid Control and Optimization (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (335 citations), Mechanical Engineering (122 citations), Ceramics and Composites (18 citations), Automotive Engineering (30 citations) and Control and Systems Engineering (46 citations). Hai Jun Ren has collaborated with scholars based in China and United Kingdom. Frequent co-authors include Li Ran, Wei Lai, Philip Mawby, Hui Li, Ran Yao, Olayiwola M. Alatise, Borong Hu, Zheng Zeng, Jose Ortiz Gonzalez and Hua Lu. Their work appears in journals such as IEEE Journal of Emerging and Selected Topics in Power Electronics, IEEE Transactions on Electron Devices, IEEE Transactions on Instrumentation and Measurement, IEEE Transactions on Device and Materials Reliability and International Journal of Heat and Mass Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.