Guicui Fu
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 24
- Silicon Carbide Semiconductor Technologies 21
- 3D IC and TSV technologies 10
- Electrostatic Discharge in Electronics 9
- Electromagnetic Compatibility and Noise Suppression 7
- Radiation Effects in Electronics 6
- Co-authors
- Bo Wan (38 shared papers)Peng Xue (10 shared papers)Yutai Su (15 shared papers)Youhu Zhao (8 shared papers)Dong Zhang (2 shared papers)Changqing Liu (2 shared papers)Canyu Liu (2 shared papers)Enrico Zio (1 shared paper)
- Journals
- Microelectronics Reliability (9 papers)Engineering Failure Analysis (6 papers)Solid-State Electronics (3 papers)IEEE Access (3 papers)Computer Modeling in Engineering & Sciences (2 papers)
- Partner nations
- ChinaUnited KingdomDenmark
In The Last Decade
Guicui Fu
79 papers receiving 461 citations
Peers
Comparison fields: 5 of 59
- Electrical and Electronic Engineering 296
- Mechanical Engineering 176
- Statistics, Probability and Uncertainty 28
- Safety, Risk, Reliability and Quality 36
- Mechanics of Materials 75
Countries citing papers authored by Guicui Fu
This map shows the geographic impact of Guicui Fu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guicui Fu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guicui Fu more than expected).
Fields of papers citing papers by Guicui Fu
This network shows the impact of papers produced by Guicui Fu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guicui Fu. The network helps show where Guicui Fu may publish in the future.
Co-authors
The 25 scholars most cited alongside Guicui Fu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 82 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 49 | |
| 2 | 2016 | 39 | |
| 3 | 2017 | 26 | |
| 4 | 2017 | 22 | |
| 5 | 2020 | 18 | |
| 6 | 2015 | 16 | |
| 7 | 2021 | 15 | |
| 8 | 2021 | 14 | |
| 9 | 2021 | 13 | |
| 10 | 2017 | 12 | |
| 11 | 2020 | 9 | |
| 12 | 2020 | 9 | |
| 13 | 2019 | 9 | |
| 14 | 2017 | 9 | |
| 15 | 2014 | 8 | |
| 16 | 2017 | 7 | |
| 17 | 2021 | 7 | |
| 18 | 2012 | 7 | |
| 19 | 2019 | 7 | |
| 20 | 2021 | 7 |
About Guicui Fu
Guicui Fu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Safety, Risk, Reliability and Quality and Control and Systems Engineering, having authored 82 papers that have together received 472 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), Silicon Carbide Semiconductor Technologies (21 papers), 3D IC and TSV technologies (10 papers), Reliability and Maintenance Optimization (10 papers), Electrostatic Discharge in Electronics (9 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Radiation Effects in Electronics (6 papers) and Probabilistic and Robust Engineering Design (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (296 citations), Mechanical Engineering (176 citations), Statistics, Probability and Uncertainty (28 citations), Safety, Risk, Reliability and Quality (36 citations) and Mechanics of Materials (75 citations). Guicui Fu has collaborated with scholars based in China, United Kingdom and Denmark. Frequent co-authors include Bo Wan, Peng Xue, Yutai Su, Youhu Zhao, Dong Zhang, Changqing Liu, Canyu Liu, Enrico Zio, Katsuaki Suganuma and Chuantong Chen. Their work appears in journals such as Microelectronics Reliability, Engineering Failure Analysis, Solid-State Electronics, IEEE Access and Computer Modeling in Engineering & Sciences.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.