Fu Guo
Impact in
- Mechanical Engineering top 1%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Extraction and Separation Processes
- General Materials Science top 0.5%
Papers in
-
- Electronic Packaging and Soldering Technologies 105
- 3D IC and TSV technologies 59
-
- Advanced Welding Techniques Analysis 34
- Aluminum Alloys Composites Properties 25
- Intermetallics and Advanced Alloy Properties 17
- Co-authors
- Yongping Lei (25 shared papers)Zhidong Xia (22 shared papers)Jing Han (25 shared papers)Yufeng Wu (7 shared papers)K. N. Subramanian (5 shared papers)J. P. Lucas (4 shared papers)Limin Ma (33 shared papers)Guangchen Xu (11 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (25 papers)Journal of Electronic Materials (25 papers)Journal of Materials Science (8 papers)Journal of Alloys and Compounds (6 papers)Materials Science and Engineering A (4 papers)
- Partner nations
- ChinaUnited StatesCanada
In The Last Decade
Fu Guo
139 papers receiving 2.1k citations
Peers
Comparison fields: 5 of 58
- Mechanical Engineering 1.5k
- General Materials Science 108
- Electrical and Electronic Engineering 1.6k
- Industrial and Manufacturing Engineering 183
- Aerospace Engineering 212
Countries citing papers authored by Fu Guo
This map shows the geographic impact of Fu Guo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fu Guo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fu Guo more than expected).
Fields of papers citing papers by Fu Guo
This network shows the impact of papers produced by Fu Guo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fu Guo. The network helps show where Fu Guo may publish in the future.
Co-authors
The 25 scholars most cited alongside Fu Guo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 145 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 166 | |
| 2 | 2007 | 112 | |
| 3 | 2006 | 99 | |
| 4 | 2005 | 77 | |
| 5 | 2001 | 75 | |
| 6 | 2003 | 67 | |
| 7 | 2005 | 60 | |
| 8 | 2009 | 57 | |
| 9 | 2007 | 51 | |
| 10 | 2000 | 51 | |
| 11 | 2008 | 50 | |
| 12 | 2011 | 43 | |
| 13 | 2014 | 42 | |
| 14 | 2016 | 40 | |
| 15 | 2017 | 40 | |
| 16 | 2007 | 39 | |
| 17 | 2007 | 36 | |
| 18 | 2023 | 34 | |
| 19 | 2012 | 30 | |
| 20 | 2008 | 29 |
About Fu Guo
Fu Guo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry and Mechanics of Materials, having authored 145 papers that have together received 2.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (105 papers), 3D IC and TSV technologies (59 papers), Advanced Welding Techniques Analysis (34 papers), Aluminum Alloys Composites Properties (25 papers), Intermetallics and Advanced Alloy Properties (17 papers), Copper Interconnects and Reliability (16 papers), Metallurgical and Alloy Processes (11 papers) and Aluminum Alloy Microstructure Properties (10 papers). The work is most often cited by research in Mechanical Engineering (1.5k citations), General Materials Science (108 citations), Electrical and Electronic Engineering (1.6k citations), Industrial and Manufacturing Engineering (183 citations) and Aerospace Engineering (212 citations). Fu Guo has collaborated with scholars based in China, United States and Canada. Frequent co-authors include Yongping Lei, Zhidong Xia, Jing Han, Yufeng Wu, K. N. Subramanian, J. P. Lucas, Limin Ma, Guangchen Xu, Xiaoyan Li and Hao Hu. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Electronic Materials, Journal of Materials Science, Journal of Alloys and Compounds and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.