Yongping Lei

171 papers and 3.8k indexed citations i.

About

Yongping Lei is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Yongping Lei has authored 171 papers receiving a total of 3.8k indexed citations (citations by other indexed papers that have themselves been cited), including 149 papers in Mechanical Engineering, 57 papers in Electrical and Electronic Engineering and 53 papers in Materials Chemistry. Recurrent topics in Yongping Lei’s work include Electronic Packaging and Soldering Technologies (51 papers), Metal Alloys Wear and Properties (38 papers) and Advanced materials and composites (35 papers). Yongping Lei is often cited by papers focused on Electronic Packaging and Soldering Technologies (51 papers), Metal Alloys Wear and Properties (38 papers) and Advanced materials and composites (35 papers). Yongping Lei collaborates with scholars based in China, Japan and Ireland. Yongping Lei's co-authors include Hanguang Fu, Yao Shi, Jian Lin, Zhidong Xia, Fu Guo, Xiaoyan Li, Jinguo Ge, Hidekazu Murakawa, Yinghua Lin and Ninshu Ma and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Applied Surface Science.

In The Last Decade

Co-authorship network of co-authors of Yongping Lei i

Fields of papers citing papers by Yongping Lei

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

This network shows the specialization of papers citing the papers produced by Yongping Lei. Nodes represent fields, and links connect fields that are likely to share authors. The network helps show where Yongping Lei may publish in the future.

Countries citing papers authored by Yongping Lei

Since Specialization
Citations

This map shows the geographic impact of Yongping Lei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yongping Lei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yongping Lei more than expected).

Rankless by CCL
2025