F. Patrick McCluskey
Impact in
- Mechanical Engineering top 5%
- Phase Change Materials Research
- Adsorption and Cooling Systems
- Aluminum Alloys Composites Properties
-
- Solar Thermal and Photovoltaic Systems
Papers in
-
- Electronic Packaging and Soldering Technologies 29
- 3D IC and TSV technologies 16
- Silicon Carbide Semiconductor Technologies 7
- Semiconductor materials and devices 6
- Electromagnetic Compatibility and Noise Suppression 5
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- Aluminum Alloys Composites Properties 8
- Heat Transfer and Optimization 6
- Co-authors
- Nicholas R. Jankowski (4 shared papers)Manas Ranjan Dash (2 shared papers)D. Huff (2 shared papers)Zhiguo Wang (2 shared papers)Michael Pecht (3 shared papers)Rui Wu (2 shared papers)Johannes Karl Fink (2 shared papers)Raphael Mandel (5 shared papers)
- Journals
- Microelectronics Reliability (4 papers)Applied Physics Letters (2 papers)Cryogenics (1 paper)Journal of The Electrochemical Society (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)
- Partner nations
- United StatesSwitzerlandPuerto Rico
In The Last Decade
F. Patrick McCluskey
56 papers receiving 949 citations
F. Patrick McCluskey's Hit Papers
Peers
Comparison fields: 5 of 74
- Mechanical Engineering 599
- Renewable Energy, Sustainability and the Environment 178
- Electrical and Electronic Engineering 535
- Automotive Engineering 76
- Management of Technology and Innovation 27
Countries citing papers authored by F. Patrick McCluskey
This map shows the geographic impact of F. Patrick McCluskey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. Patrick McCluskey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. Patrick McCluskey more than expected).
Fields of papers citing papers by F. Patrick McCluskey
This network shows the impact of papers produced by F. Patrick McCluskey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. Patrick McCluskey. The network helps show where F. Patrick McCluskey may publish in the future.
Co-authors
The 25 scholars most cited alongside F. Patrick McCluskey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | A review of phase change materials for vehicle component thermal buffering Hit paper breakdown → | 2013 | 375 |
| 2 | 2006 | 78 | |
| 3 | 2011 | 58 | |
| 4 | 2009 | 37 | |
| 5 | 2009 | 35 | |
| 6 | 2009 | 20 | |
| 7 | 2019 | 20 | |
| 8 | 2013 | 20 | |
| 9 | 1997 | 20 | |
| 10 | 2016 | 18 | |
| 11 | 2009 | 18 | |
| 12 | 1991 | 16 | |
| 13 | 1989 | 16 | |
| 14 | 2014 | 16 | |
| 15 | 2014 | 15 | |
| 16 | 2014 | 15 | |
| 17 | 1998 | 14 | |
| 18 | 2009 | 14 | |
| 19 | 2010 | 13 | |
| 20 | 1996 | 13 |
About F. Patrick McCluskey
F. Patrick McCluskey is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Automotive Engineering and Mechanics of Materials, having authored 60 papers that have together received 987 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (16 papers), Aluminum Alloys Composites Properties (8 papers), Silicon Carbide Semiconductor Technologies (7 papers), Heat Transfer and Optimization (6 papers), Semiconductor materials and devices (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers) and Acoustic Wave Resonator Technologies (4 papers). The work is most often cited by research in Mechanical Engineering (599 citations), Renewable Energy, Sustainability and the Environment (178 citations), Electrical and Electronic Engineering (535 citations), Automotive Engineering (76 citations) and Management of Technology and Innovation (27 citations). F. Patrick McCluskey has collaborated with scholars based in United States, Switzerland and Puerto Rico. Frequent co-authors include Nicholas R. Jankowski, Manas Ranjan Dash, D. Huff, Zhiguo Wang, Michael Pecht, Rui Wu, Johannes Karl Fink, Raphael Mandel, Peter Sandborn and Edward B. Magrab. Their work appears in journals such as Microelectronics Reliability, Applied Physics Letters, Cryogenics, Journal of The Electrochemical Society and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.