D. Huff
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced DC-DC Converters
Papers in
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- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 7
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- Silicon and Solar Cell Technologies 3
- Surgery 8
- Orthopaedic implants and arthroplasty 8
- Total Knee Arthroplasty Outcomes 4
- Orthopedic Infections and Treatments 3
- Co-authors
- Rolando Burgos (1 shared paper)Dushan Boroyevich (1 shared paper)F. Wang (1 shared paper)F. Patrick McCluskey (2 shared papers)Zhiguo Wang (2 shared papers)Manas Ranjan Dash (2 shared papers)Rixin Lai (3 shared papers)Puqi Ning (3 shared papers)
- Journals
- Journal of Orthopaedic Research® (2 papers)Clinical Biomechanics (2 papers)Computer Methods in Biomechanics & Biomedical Engineering (1 paper)Journal of ASTM International (1 paper)Journal of Biomechanics (1 paper)
- Partner nations
- United StatesAustraliaNew Zealand
In The Last Decade
D. Huff
23 papers receiving 455 citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 329
- Ceramics and Composites 25
- Mechanical Engineering 120
- Surgery 109
- General Materials Science 4
Countries citing papers authored by D. Huff
This map shows the geographic impact of D. Huff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Huff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Huff more than expected).
Fields of papers citing papers by D. Huff
This network shows the impact of papers produced by D. Huff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Huff. The network helps show where D. Huff may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Huff, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 116 | |
| 2 | 2009 | 94 | |
| 3 | 2006 | 78 | |
| 4 | 2017 | 36 | |
| 5 | 2018 | 27 | |
| 6 | 2002 | 20 | |
| 7 | 2018 | 18 | |
| 8 | 2004 | 17 | |
| 9 | 2018 | 15 | |
| 10 | 2009 | 11 | |
| 11 | 2018 | 10 | |
| 12 | 2021 | 9 | |
| 13 | 2020 | 7 | |
| 14 | 2006 | 7 | |
| 15 | 2002 | 4 | |
| 16 | 2020 | 4 | |
| 17 | 2008 | 3 | |
| 18 | 2004 | 2 | |
| 19 | 2002 | 2 | |
| 20 | 2001 | 1 |
About D. Huff
D. Huff is a scholar working on Electrical and Electronic Engineering, Surgery, Mechanics of Materials, Mechanical Engineering and Civil and Structural Engineering, having authored 23 papers that have together received 484 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Orthopaedic implants and arthroplasty (8 papers), 3D IC and TSV technologies (7 papers), Silicon Carbide Semiconductor Technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Total Knee Arthroplasty Outcomes (4 papers), Silicon and Solar Cell Technologies (3 papers) and Orthopedic Infections and Treatments (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (329 citations), Ceramics and Composites (25 citations), Mechanical Engineering (120 citations), Surgery (109 citations) and General Materials Science (4 citations). D. Huff has collaborated with scholars based in United States, Australia and New Zealand. Frequent co-authors include Rolando Burgos, Dushan Boroyevich, F. Wang, F. Patrick McCluskey, Zhiguo Wang, Manas Ranjan Dash, Rixin Lai, Puqi Ning, Khai D. T. Ngo and Kamiar Karimi. Their work appears in journals such as Journal of Orthopaedic Research®, Clinical Biomechanics, Computer Methods in Biomechanics & Biomedical Engineering, Journal of ASTM International and Journal of Biomechanics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.