Didier Cottet
Impact in
- Human-Computer Interaction top 5%
- Interactive and Immersive Displays
-
- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced DC-DC Converters
Papers in
-
- Electromagnetic Compatibility and Noise Suppression 21
- Silicon Carbide Semiconductor Technologies 15
- Microwave Engineering and Waveguides 6
- Advanced DC-DC Converters 5
- Electromagnetic Compatibility and Measurements 4
- Electronic Packaging and Soldering Technologies 3
- Co-authors
- Gerhard Tröster (9 shared papers)Janusz Grzyb (8 shared papers)Tünde Kirstein (2 shared papers)Uwe Drofenik (4 shared papers)Jean‐Marc Meyer (3 shared papers)A. Musing (3 shared papers)Johann W. Kolar (3 shared papers)Stefan Jung (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (1 paper)Journal of Thermal Science and Engineering Applications (1 paper)Proceedings of the IEEE (1 paper)Microelectronics Reliability (1 paper)Epubl LTU (1 paper)
- Partner nations
- SwitzerlandSwedenPoland
In The Last Decade
Didier Cottet
33 papers receiving 710 citations
Peers
Comparison fields: 5 of 72
- Human-Computer Interaction 67
- Electrical and Electronic Engineering 461
- Polymers and Plastics 103
- Biomedical Engineering 262
- Media Technology 33
Countries citing papers authored by Didier Cottet
This map shows the geographic impact of Didier Cottet's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Didier Cottet with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Didier Cottet more than expected).
Fields of papers citing papers by Didier Cottet
This network shows the impact of papers produced by Didier Cottet. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Didier Cottet. The network helps show where Didier Cottet may publish in the future.
Co-authors
The 25 scholars most cited alongside Didier Cottet, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 233 | |
| 2 | 2003 | 169 | |
| 3 | 2007 | 44 | |
| 4 | 2007 | 31 | |
| 5 | Modelling the thermal coupling between internal power semiconductor dies of a water-cooled 3300V/1200A HiPak IGBT module | 2007 | 27 |
| 6 | 2015 | 26 | |
| 7 | 2015 | 22 | |
| 8 | 2008 | 18 | |
| 9 | Design Tools for Power Electronics : Trends and Innovations | 2007 | 17 |
| 10 | 2006 | 15 | |
| 11 | 2015 | 15 | |
| 12 | 2008 | 14 | |
| 13 | 2004 | 14 | |
| 14 | 2008 | 13 | |
| 15 | 2013 | 9 | |
| 16 | 2008 | 9 | |
| 17 | 2006 | 8 | |
| 18 | 2010 | 7 | |
| 19 | Bus Bar Simulations Using the PEEC Method | 2010 | 6 |
| 20 | 2010 | 6 |
About Didier Cottet
Didier Cottet is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Astronomy and Astrophysics, Aerospace Engineering and Hardware and Architecture, having authored 36 papers that have together received 749 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (21 papers), Silicon Carbide Semiconductor Technologies (15 papers), Microwave Engineering and Waveguides (6 papers), Advanced DC-DC Converters (5 papers), Electromagnetic Compatibility and Measurements (4 papers), Lightning and Electromagnetic Phenomena (3 papers), Advanced Antenna and Metasurface Technologies (3 papers) and Electronic Packaging and Soldering Technologies (3 papers). The work is most often cited by research in Human-Computer Interaction (67 citations), Electrical and Electronic Engineering (461 citations), Polymers and Plastics (103 citations), Biomedical Engineering (262 citations) and Media Technology (33 citations). Didier Cottet has collaborated with scholars based in Switzerland, Sweden and Poland. Frequent co-authors include Gerhard Tröster, Janusz Grzyb, Tünde Kirstein, Uwe Drofenik, Jean‐Marc Meyer, A. Musing, Johann W. Kolar, Stefan Jung, Zahi Nakad and Tom Martin. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Journal of Thermal Science and Engineering Applications, Proceedings of the IEEE, Microelectronics Reliability and Epubl LTU.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.