Adrian Lis
Impact in
- Mechanical Engineering top 10%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Microstructure and Mechanical Properties of Steels
Papers in
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- Aluminum Alloys Composites Properties 7
- Intermetallics and Advanced Alloy Properties 4
- Microstructure and Mechanical Properties of Steels 3
- Advanced Welding Techniques Analysis 3
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- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 7
- Silicon Carbide Semiconductor Technologies 4
- Co-authors
- Christian Leinenbach (11 shared papers)Wookjin Lee (4 shared papers)Christoph Kenel (4 shared papers)A. Arabi-Hashemi (2 shared papers)Min Soo Park (1 shared paper)Raymundo Arróyave (1 shared paper)Akio Hirose (9 shared papers)T. Matsuda (7 shared papers)
- Journals
- Journal of Electronic Materials (5 papers)Materials Science and Engineering A (3 papers)Applied Sciences (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Journal of Alloys and Compounds (1 paper)
- Partner nations
- JapanSwitzerlandGermany
In The Last Decade
Adrian Lis
23 papers receiving 437 citations
Peers
Comparison fields: 5 of 29
- Mechanical Engineering 325
- Metals and Alloys 20
- Electrical and Electronic Engineering 194
- Materials Chemistry 138
- General Materials Science 9
Countries citing papers authored by Adrian Lis
This map shows the geographic impact of Adrian Lis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Adrian Lis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Adrian Lis more than expected).
Fields of papers citing papers by Adrian Lis
This network shows the impact of papers produced by Adrian Lis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Adrian Lis. The network helps show where Adrian Lis may publish in the future.
Co-authors
The 25 scholars most cited alongside Adrian Lis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 55 | |
| 2 | 2015 | 54 | |
| 3 | 2014 | 54 | |
| 4 | 2017 | 46 | |
| 5 | 2017 | 42 | |
| 6 | 2018 | 28 | |
| 7 | 2019 | 26 | |
| 8 | 2013 | 21 | |
| 9 | 2015 | 19 | |
| 10 | 2016 | 19 | |
| 11 | 2016 | 18 | |
| 12 | 2019 | 11 | |
| 13 | 2012 | 8 | |
| 14 | 2022 | 7 | |
| 15 | 2018 | 7 | |
| 16 | 2018 | 6 | |
| 17 | Application considerations for Double Sided Cooled Modules in Automotive Environment | 2020 | 5 |
| 18 | 2017 | 5 | |
| 19 | Defect assessment of brazed steel components | 2012 | 4 |
| 20 | 2019 | 3 |
About Adrian Lis
Adrian Lis is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Civil and Structural Engineering, Materials Chemistry and Automotive Engineering, having authored 24 papers that have together received 442 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), Aluminum Alloys Composites Properties (7 papers), 3D IC and TSV technologies (7 papers), Silicon Carbide Semiconductor Technologies (4 papers), Intermetallics and Advanced Alloy Properties (4 papers), Microstructure and Mechanical Properties of Steels (3 papers), Advanced Welding Techniques Analysis (3 papers) and Structural Load-Bearing Analysis (3 papers). The work is most often cited by research in Mechanical Engineering (325 citations), Metals and Alloys (20 citations), Electrical and Electronic Engineering (194 citations), Materials Chemistry (138 citations) and General Materials Science (9 citations). Adrian Lis has collaborated with scholars based in Japan, Switzerland and Germany. Frequent co-authors include Christian Leinenbach, Wookjin Lee, Christoph Kenel, A. Arabi-Hashemi, Min Soo Park, Raymundo Arróyave, Akio Hirose, T. Matsuda, Tomokazu Sano and Cyril Cayron. Their work appears in journals such as Journal of Electronic Materials, Materials Science and Engineering A, Applied Sciences, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.