David Shaddock
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
- Silicon Carbide Semiconductor Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 12
- Silicon Carbide Semiconductor Technologies 8
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- Intermetallics and Advanced Alloy Properties 8
- Aluminum Alloys Composites Properties 5
- Co-authors
- Junghyun Cho (12 shared papers)Liang Yin (17 shared papers)Aaron Knobloch (5 shared papers)Shubhra Bansal (4 shared papers)Wayne Johnson (9 shared papers)Nancy Stoffel (7 shared papers)Peter Børgesen (8 shared papers)Mohammed Alhendi (10 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Advanced Engineering Materials (2 papers)Materials Science and Engineering A (1 paper)Materials Research Express (1 paper)Additive manufacturing (1 paper)
- Partner nations
- United StatesNorwayIsrael
In The Last Decade
David Shaddock
42 papers receiving 332 citations
Peers
Comparison fields: 5 of 39
- Automotive Engineering 60
- Electrical and Electronic Engineering 243
- Mechanical Engineering 137
- General Materials Science 9
- Ceramics and Composites 15
Countries citing papers authored by David Shaddock
This map shows the geographic impact of David Shaddock's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Shaddock with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Shaddock more than expected).
Fields of papers citing papers by David Shaddock
This network shows the impact of papers produced by David Shaddock. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Shaddock. The network helps show where David Shaddock may publish in the future.
Co-authors
The 25 scholars most cited alongside David Shaddock, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 51 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 49 | |
| 2 | 2009 | 35 | |
| 3 | 2005 | 20 | |
| 4 | 2003 | 20 | |
| 5 | 2018 | 17 | |
| 6 | 2010 | 16 | |
| 7 | 2011 | 15 | |
| 8 | 2010 | 14 | |
| 9 | 2022 | 12 | |
| 10 | 2017 | 11 | |
| 11 | 2014 | 10 | |
| 12 | 2012 | 9 | |
| 13 | 2014 | 8 | |
| 14 | 2012 | 8 | |
| 15 | 2012 | 7 | |
| 16 | 2018 | 7 | |
| 17 | 2003 | 7 | |
| 18 | 2015 | 7 | |
| 19 | 2023 | 6 | |
| 20 | 2018 | 6 |
About David Shaddock
David Shaddock is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics, having authored 51 papers that have together received 342 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (12 papers), Silicon Carbide Semiconductor Technologies (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Intermetallics and Advanced Alloy Properties (8 papers), Semiconductor materials and interfaces (7 papers), Aluminum Alloys Composites Properties (5 papers) and Aluminum Alloy Microstructure Properties (5 papers). The work is most often cited by research in Automotive Engineering (60 citations), Electrical and Electronic Engineering (243 citations), Mechanical Engineering (137 citations), General Materials Science (9 citations) and Ceramics and Composites (15 citations). David Shaddock has collaborated with scholars based in United States, Norway and Israel. Frequent co-authors include Junghyun Cho, Liang Yin, Aaron Knobloch, Shubhra Bansal, Wayne Johnson, Nancy Stoffel, Peter Børgesen, Mohammed Alhendi, Mark D. Poliks and Jianbiao Pan. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Advanced Engineering Materials, Materials Science and Engineering A, Materials Research Express and Additive manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.