Chun‐Sean Lau

11 papers and 181 indexed citations i.

Chun‐Sean Lau has authored 11 papers that have received a total of 181 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 5 papers in Mechanics of Materials and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Adhesion, Friction, and Surface Interactions (2 papers). Chun‐Sean Lau is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Adhesion, Friction, and Surface Interactions (2 papers) and collaborates with scholars based in Malaysia and United States. Chun‐Sean Lau's co-authors include M.Z. Abdullah, Fakhrozi Che Ani, C. Y. Khor, Mohd Sharizal Abdul Aziz and W. H. Tan and has published in prestigious journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology and Soldering and Surface Mount Technology.