Soldering and Surface Mount Technology
About
The 800 papers published in Soldering and Surface Mount Technology in the last decades have received a total of 6.8k indexed citations.
Papers published in Soldering and Surface Mount Technology usually cover Electrical and Electronic Engineering (709 papers), Mechanical Engineering (376 papers) and Mechanics of Materials (121 papers) specifically the topics of Electronic Packaging and Soldering Technologies (670 papers), 3D IC and TSV technologies (365 papers) and Advanced Welding Techniques Analysis (116 papers). The most active scholars publishing in Soldering and Surface Mount Technology are Dongkai Shangguan, J. Sitek, N.N. Ekere, Olivér Krammer and M.Z. Abdullah.
In The Last Decade
Fields of papers published in Soldering and Surface Mount Technology
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries where authors publish in Soldering and Surface Mount Technology
Since SpecializationTotal citations of papers
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