Chien-Shing Pai
Impact in
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- Copper Interconnects and Reliability
Papers in
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- Advanced MEMS and NEMS Technologies 5
- Photonic and Optical Devices 3
- 3D IC and TSV technologies 3
- Semiconductor materials and devices 3
- Semiconductor Lasers and Optical Devices 2
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- Copper Interconnects and Reliability 6
- Co-authors
- Omkaram Nalamasu (3 shared papers)Yang Shu (3 shared papers)Elsa Reichmanis (3 shared papers)Eric K. Lin (2 shared papers)Jianing Sun (2 shared papers)Ruichen Liu (3 shared papers)Hae‐Jeong Lee (2 shared papers)Peter A. Mirau (2 shared papers)
- Journals
- Chemistry of Materials (2 papers)IEEE Transactions on Advanced Packaging (1 paper)Journal of Microelectromechanical Systems (1 paper)Bell Labs Technical Journal (1 paper)Journal of Lightwave Technology (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
Chien-Shing Pai
12 papers receiving 447 citations
Peers
Comparison fields: 5 of 40
- Electronic, Optical and Magnetic Materials 146
- Surfaces, Coatings and Films 34
- Electrical and Electronic Engineering 277
- Ceramics and Composites 27
- Polymers and Plastics 65
Countries citing papers authored by Chien-Shing Pai
This map shows the geographic impact of Chien-Shing Pai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chien-Shing Pai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chien-Shing Pai more than expected).
Fields of papers citing papers by Chien-Shing Pai
This network shows the impact of papers produced by Chien-Shing Pai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chien-Shing Pai. The network helps show where Chien-Shing Pai may publish in the future.
Co-authors
The 25 scholars most cited alongside Chien-Shing Pai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 152 | |
| 2 | 2002 | 117 | |
| 3 | 2001 | 85 | |
| 4 | 1999 | 54 | |
| 5 | 2003 | 16 | |
| 6 | 2001 | 12 | |
| 7 | 2007 | 10 | |
| 8 | 2005 | 10 | |
| 9 | 2005 | 6 | |
| 10 | 2007 | 4 | |
| 11 | 2002 | 4 | |
| 12 | 2002 | 2 | |
| 13 | 2005 | 0 |
About Chien-Shing Pai
Chien-Shing Pai is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Biomedical Engineering and Ceramics and Composites, having authored 13 papers that have together received 472 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (6 papers), Advanced MEMS and NEMS Technologies (5 papers), Photonic and Optical Devices (3 papers), 3D IC and TSV technologies (3 papers), Semiconductor materials and devices (3 papers), Silicone and Siloxane Chemistry (3 papers), Semiconductor Lasers and Optical Devices (2 papers) and Advanced ceramic materials synthesis (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (146 citations), Surfaces, Coatings and Films (34 citations), Electrical and Electronic Engineering (277 citations), Ceramics and Composites (27 citations) and Polymers and Plastics (65 citations). Chien-Shing Pai has collaborated with scholars based in United States and Germany. Frequent co-authors include Omkaram Nalamasu, Yang Shu, Elsa Reichmanis, Eric K. Lin, Jianing Sun, Ruichen Liu, Hae‐Jeong Lee, Peter A. Mirau, David W. Gidley and Emilio A. Martı́nez. Their work appears in journals such as Chemistry of Materials, IEEE Transactions on Advanced Packaging, Journal of Microelectromechanical Systems, Bell Labs Technical Journal and Journal of Lightwave Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.