C.D. Breach
Impact in
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 29
- 3D IC and TSV technologies 14
-
- Aluminum Alloys Composites Properties 10
- Advanced Welding Techniques Analysis 9
- Metal Forming Simulation Techniques 5
- Co-authors
- F. Wulff (23 shared papers)Saraswati Saraswati (5 shared papers)C.S. Goh (2 shared papers)Subodh G. Mhaisalkar (6 shared papers)Thirumany Sritharan (3 shared papers)Richard Holliday (5 shared papers)C.C. Wong (5 shared papers)Athene M. Donald (1 shared paper)
- Journals
- Thin Solid Films (4 papers)Microelectronics Reliability (4 papers)Polymer (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Alloys and Compounds (1 paper)
- Partner nations
- SingaporeUnited KingdomGermany
In The Last Decade
C.D. Breach
43 papers receiving 690 citations
Peers
Comparison fields: 5 of 51
- Mechanical Engineering 370
- Electrical and Electronic Engineering 546
- Mechanics of Materials 140
- Electronic, Optical and Magnetic Materials 101
- General Materials Science 14
Countries citing papers authored by C.D. Breach
This map shows the geographic impact of C.D. Breach's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.D. Breach with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.D. Breach more than expected).
Fields of papers citing papers by C.D. Breach
This network shows the impact of papers produced by C.D. Breach. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.D. Breach. The network helps show where C.D. Breach may publish in the future.
Co-authors
The 22 scholars most cited alongside C.D. Breach, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 92 | |
| 2 | 2009 | 84 | |
| 3 | 2005 | 77 | |
| 4 | 2013 | 59 | |
| 5 | 2010 | 56 | |
| 6 | 2006 | 42 | |
| 7 | 2006 | 28 | |
| 8 | 2004 | 22 | |
| 9 | 1997 | 21 | |
| 10 | 2003 | 20 | |
| 11 | 2009 | 18 | |
| 12 | 2005 | 15 | |
| 13 | 2004 | 14 | |
| 14 | 2006 | 14 | |
| 15 | 2005 | 14 | |
| 16 | 1996 | 13 | |
| 17 | 2010 | 13 | |
| 18 | 1992 | 11 | |
| 19 | 2012 | 10 | |
| 20 | 2006 | 10 |
About C.D. Breach
C.D. Breach is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Aerospace Engineering, having authored 44 papers that have together received 768 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (14 papers), Aluminum Alloys Composites Properties (10 papers), Advanced Welding Techniques Analysis (9 papers), Aluminum Alloy Microstructure Properties (6 papers), Metal Forming Simulation Techniques (5 papers), Microstructure and mechanical properties (4 papers) and Material Properties and Processing (4 papers). The work is most often cited by research in Mechanical Engineering (370 citations), Electrical and Electronic Engineering (546 citations), Mechanics of Materials (140 citations), Electronic, Optical and Magnetic Materials (101 citations) and General Materials Science (14 citations). C.D. Breach has collaborated with scholars based in Singapore, United Kingdom and Germany. Frequent co-authors include F. Wulff, Saraswati Saraswati, C.S. Goh, Subodh G. Mhaisalkar, Thirumany Sritharan, Richard Holliday, C.C. Wong, Athene M. Donald, A. C. Smith and Kai‐Tak Wan. Their work appears in journals such as Thin Solid Films, Microelectronics Reliability, Polymer, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.