Alan Huffman
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 35
- Electronic Packaging and Soldering Technologies 30
- CCD and CMOS Imaging Sensors 4
-
- Additive Manufacturing and 3D Printing Technologies 8
- Co-authors
- Matthew Lueck (25 shared papers)D. Temple (21 shared papers)John Lannon (16 shared papers)Christopher W. Gregory (10 shared papers)Aric Shorey (2 shared papers)John M. Lannon (8 shared papers)Chris Gregory (10 shared papers)Jason D. Reed (7 shared papers)
- Journals
- Annals of Emergency Medicine (10 papers)IEEE Transactions on Advanced Packaging (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)Lingua (1 paper)Journal of Electronic Materials (1 paper)
- Partner nations
- United StatesGermanySingapore
In The Last Decade
Alan Huffman
63 papers receiving 477 citations
Peers
Comparison fields: 5 of 71
- Electrical and Electronic Engineering 397
- Automotive Engineering 61
- Language and Linguistics 51
- Linguistics and Language 17
- Electronic, Optical and Magnetic Materials 54
Countries citing papers authored by Alan Huffman
This map shows the geographic impact of Alan Huffman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Alan Huffman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Alan Huffman more than expected).
Fields of papers citing papers by Alan Huffman
This network shows the impact of papers produced by Alan Huffman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Alan Huffman. The network helps show where Alan Huffman may publish in the future.
Co-authors
The 25 scholars most cited alongside Alan Huffman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 69 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 37 | |
| 2 | 2014 | 33 | |
| 3 | 2012 | 28 | |
| 4 | 2010 | 27 | |
| 5 | 2015 | 27 | |
| 6 | 2007 | 22 | |
| 7 | 2001 | 21 | |
| 8 | 2009 | 20 | |
| 9 | 2012 | 16 | |
| 10 | 2010 | 16 | |
| 11 | 2007 | 15 | |
| 12 | 2009 | 15 | |
| 13 | 2008 | 13 | |
| 14 | 2005 | 13 | |
| 15 | 2016 | 12 | |
| 16 | 1997 | 11 | |
| 17 | The categories of grammar : French lui and le | 1997 | 11 |
| 18 | 2013 | 10 | |
| 19 | 2014 | 10 | |
| 20 | 2002 | 9 |
About Alan Huffman
Alan Huffman is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, General Health Professions and Aerospace Engineering, having authored 69 papers that have together received 522 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (30 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Nanofabrication and Lithography Techniques (5 papers), Historical Linguistics and Language Studies (5 papers), Infrared Target Detection Methodologies (4 papers), Calibration and Measurement Techniques (4 papers) and CCD and CMOS Imaging Sensors (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (397 citations), Automotive Engineering (61 citations), Language and Linguistics (51 citations), Linguistics and Language (17 citations) and Electronic, Optical and Magnetic Materials (54 citations). Alan Huffman has collaborated with scholars based in United States, Germany and Singapore. Frequent co-authors include Matthew Lueck, D. Temple, John Lannon, Christopher W. Gregory, Aric Shorey, John M. Lannon, Chris Gregory, Jason D. Reed, Dean Malta and Christopher A. Bower. Their work appears in journals such as Annals of Emergency Medicine, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Lingua and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.