C. Dang
Impact in
- Materials Chemistry top 10%
- High voltage insulation and dielectric phenomena
- Spectroscopy top 10%
- Spectroscopy and Laser Applications
Papers in
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- High voltage insulation and dielectric phenomena 21
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- Electrical Contact Performance and Analysis 6
- Co-authors
- J.‐P. Crine (6 shared papers)J.-L. Parpal (6 shared papers)J. Reid (4 shared papers)Brian K. Garside (4 shared papers)Klaus J. Siemsen (1 shared paper)M. Braunović (4 shared papers)S. Pélissou (3 shared papers)M. Chaaban (1 shared paper)
- Journals
- IEEE Transactions on Power Delivery (5 papers)IEEE Journal of Quantum Electronics (3 papers)IEEE Transactions on Dielectrics and Electrical Insulation (3 papers)Applied Physics B (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- CanadaAustraliaUnited States
In The Last Decade
C. Dang
32 papers receiving 524 citations
Peers
Comparison fields: 5 of 29
- Materials Chemistry 292
- Spectroscopy 65
- Electrical and Electronic Engineering 227
- Safety, Risk, Reliability and Quality 16
- Radiology, Nuclear Medicine and Imaging 30
Countries citing papers authored by C. Dang
This map shows the geographic impact of C. Dang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Dang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Dang more than expected).
Fields of papers citing papers by C. Dang
This network shows the impact of papers produced by C. Dang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Dang. The network helps show where C. Dang may publish in the future.
Co-authors
The 10 scholars most cited alongside C. Dang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 102 | |
| 2 | 1996 | 100 | |
| 3 | 1982 | 67 | |
| 4 | 1980 | 61 | |
| 5 | 1983 | 42 | |
| 6 | 1997 | 41 | |
| 7 | 1983 | 31 | |
| 8 | 2002 | 17 | |
| 9 | 2003 | 17 | |
| 10 | 1986 | 16 | |
| 11 | 1980 | 15 | |
| 12 | 1996 | 9 | |
| 13 | 1990 | 8 | |
| 14 | 2002 | 7 | |
| 15 | 2002 | 6 | |
| 16 | 2018 | 6 | |
| 17 | 2002 | 5 | |
| 18 | 1999 | 3 | |
| 19 | 2002 | 3 | |
| 20 | Aging of extruded dielectric power cables: Theory | 1992 | 2 |
About C. Dang
C. Dang is a scholar working on Materials Chemistry, Mechanical Engineering, Control and Systems Engineering, Electrical and Electronic Engineering and Spectroscopy, having authored 32 papers that have together received 577 indexed citations. Recurring topics across this work include High voltage insulation and dielectric phenomena (21 papers), Electrical Contact Performance and Analysis (6 papers), Laser Design and Applications (5 papers), Thermal Analysis in Power Transmission (4 papers), Spectroscopy and Laser Applications (2 papers), Lightning and Electromagnetic Phenomena (1 paper), High-Voltage Power Transmission Systems (1 paper) and Electrical Fault Detection and Protection (1 paper). The work is most often cited by research in Materials Chemistry (292 citations), Spectroscopy (65 citations), Electrical and Electronic Engineering (227 citations), Safety, Risk, Reliability and Quality (16 citations) and Radiology, Nuclear Medicine and Imaging (30 citations). C. Dang has collaborated with scholars based in Canada, Australia and United States. Frequent co-authors include J.‐P. Crine, J.-L. Parpal, J. Reid, Brian K. Garside, Klaus J. Siemsen, M. Braunović, S. Pélissou, M. Chaaban, L. Lamarre and N.G. Trinh. Their work appears in journals such as IEEE Transactions on Power Delivery, IEEE Journal of Quantum Electronics, IEEE Transactions on Dielectrics and Electrical Insulation, Applied Physics B and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.