Brian Cline
Impact in
- Hardware and Architecture top 2%
- VLSI and Analog Circuit Testing
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Low-power high-performance VLSI design
- VLSI and FPGA Design Techniques
- 3D IC and TSV technologies
- Advanced Memory and Neural Computing
- Ferroelectric and Negative Capacitance Devices
Papers in
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- Semiconductor materials and devices 33
- 3D IC and TSV technologies 22
- Low-power high-performance VLSI design 20
- Advancements in Semiconductor Devices and Circuit Design 17
- Advancements in Photolithography Techniques 17
- VLSI and FPGA Design Techniques 12
- Integrated Circuits and Semiconductor Failure Analysis 6
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- VLSI and Analog Circuit Testing 7
- Co-authors
- Greg Yeric (27 shared papers)Saurabh Sinha (26 shared papers)Yu Cao (4 shared papers)L. Shifren (7 shared papers)Vikas Chandra (7 shared papers)Lawrence T. Clark (1 shared paper)Vinay Vashishtha (1 shared paper)Chandarasekaran Ramamurthy (1 shared paper)
- Journals
- IEEE Transactions on Electron Devices (4 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (4 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (3 papers)IEEE Design and Test (1 paper)IEEE Electron Device Letters (1 paper)
- Partner nations
- United StatesUnited KingdomBelgium
In The Last Decade
Brian Cline
58 papers receiving 1.6k citations
Brian Cline's Hit Papers
Peers
Comparison fields: 5 of 56
- Hardware and Architecture 429
- Electrical and Electronic Engineering 1.5k
- Computer Networks and Communications 153
- Industrial and Manufacturing Engineering 49
- Biomedical Engineering 169
Countries citing papers authored by Brian Cline
This map shows the geographic impact of Brian Cline's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brian Cline with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brian Cline more than expected).
Fields of papers citing papers by Brian Cline
This network shows the impact of papers produced by Brian Cline. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brian Cline. The network helps show where Brian Cline may publish in the future.
Co-authors
The 25 scholars most cited alongside Brian Cline, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | ASAP7: A 7-nm finFET predictive process design kit Hit paper breakdown → | 2016 | 459 |
| 2 | 2012 | 246 | |
| 3 | 2008 | 125 | |
| 4 | 2007 | 54 | |
| 5 | 2016 | 54 | |
| 6 | 2006 | 53 | |
| 7 | 2015 | 42 | |
| 8 | 2019 | 40 | |
| 9 | 2016 | 36 | |
| 10 | 2012 | 30 | |
| 11 | 2017 | 29 | |
| 12 | 2017 | 28 | |
| 13 | 2014 | 25 | |
| 14 | 2013 | 23 | |
| 15 | 2015 | 22 | |
| 16 | 2008 | 22 | |
| 17 | 2006 | 21 | |
| 18 | 2021 | 19 | |
| 19 | 2008 | 19 | |
| 20 | 2014 | 19 |
About Brian Cline
Brian Cline is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Materials Chemistry, Computer Networks and Communications and Biomedical Engineering, having authored 60 papers that have together received 1.6k indexed citations. Recurring topics across this work include Semiconductor materials and devices (33 papers), 3D IC and TSV technologies (22 papers), Low-power high-performance VLSI design (20 papers), Advancements in Semiconductor Devices and Circuit Design (17 papers), Advancements in Photolithography Techniques (17 papers), VLSI and FPGA Design Techniques (12 papers), VLSI and Analog Circuit Testing (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). The work is most often cited by research in Hardware and Architecture (429 citations), Electrical and Electronic Engineering (1.5k citations), Computer Networks and Communications (153 citations), Industrial and Manufacturing Engineering (49 citations) and Biomedical Engineering (169 citations). Brian Cline has collaborated with scholars based in United States, United Kingdom and Belgium. Frequent co-authors include Greg Yeric, Saurabh Sinha, Yu Cao, L. Shifren, Vikas Chandra, Lawrence T. Clark, Vinay Vashishtha, Chandarasekaran Ramamurthy, David Blaauw and Dennis Sylvester. Their work appears in journals such as IEEE Transactions on Electron Devices, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE Design and Test and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.