B. Ebersberger
Impact in
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- Force Microscopy Techniques and Applications
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- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advancements in Semiconductor Devices and Circuit Design
Papers in
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- Integrated Circuits and Semiconductor Failure Analysis 19
- Semiconductor materials and devices 12
- Electronic Packaging and Soldering Technologies 4
- 3D IC and TSV technologies 4
- Advancements in Semiconductor Devices and Circuit Design 3
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- Force Microscopy Techniques and Applications 16
- Co-authors
- Alexander Olbrich (16 shared papers)Christian Boit (12 shared papers)M. Nafrı́a (8 shared papers)X. Aymerich (8 shared papers)M. Porti (8 shared papers)Charles Lee (1 shared paper)R. S. Bauer (2 shared papers)J. Vancea (3 shared papers)
- Journals
- Microelectronics Reliability (5 papers)Applied Physics Letters (4 papers)Nanotechnology (2 papers)Journal of Non-Crystalline Solids (1 paper)Microelectronic Engineering (1 paper)
- Partner nations
- GermanySpainUnited States
In The Last Decade
B. Ebersberger
26 papers receiving 521 citations
Peers
Comparison fields: 5 of 31
- Atomic and Molecular Physics, and Optics 256
- Electrical and Electronic Engineering 436
- Structural Biology 6
- Electronic, Optical and Magnetic Materials 56
- Biomedical Engineering 122
Countries citing papers authored by B. Ebersberger
This map shows the geographic impact of B. Ebersberger's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Ebersberger with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Ebersberger more than expected).
Fields of papers citing papers by B. Ebersberger
This network shows the impact of papers produced by B. Ebersberger. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Ebersberger. The network helps show where B. Ebersberger may publish in the future.
Co-authors
The 25 scholars most cited alongside B. Ebersberger, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1998 | 141 | |
| 2 | 2002 | 79 | |
| 3 | 2001 | 44 | |
| 4 | 2008 | 42 | |
| 5 | 1999 | 39 | |
| 6 | 2005 | 31 | |
| 7 | 1998 | 28 | |
| 8 | 2001 | 22 | |
| 9 | 2001 | 17 | |
| 10 | 2004 | 16 | |
| 11 | 1998 | 14 | |
| 12 | 2008 | 9 | |
| 13 | 1994 | 9 | |
| 14 | 1999 | 7 | |
| 15 | 2002 | 7 | |
| 16 | 2001 | 5 | |
| 17 | 2001 | 4 | |
| 18 | 1996 | 4 | |
| 19 | 2000 | 4 | |
| 20 | 2001 | 4 |
About B. Ebersberger
B. Ebersberger is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Materials Chemistry, Structural Biology and Surfaces, Coatings and Films, having authored 26 papers that have together received 540 indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (19 papers), Force Microscopy Techniques and Applications (16 papers), Semiconductor materials and devices (12 papers), Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers), Advanced Electron Microscopy Techniques and Applications (3 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers) and Electron and X-Ray Spectroscopy Techniques (2 papers). The work is most often cited by research in Atomic and Molecular Physics, and Optics (256 citations), Electrical and Electronic Engineering (436 citations), Structural Biology (6 citations), Electronic, Optical and Magnetic Materials (56 citations) and Biomedical Engineering (122 citations). B. Ebersberger has collaborated with scholars based in Germany, Spain and United States. Frequent co-authors include Alexander Olbrich, Christian Boit, M. Nafrı́a, X. Aymerich, M. Porti, Charles Lee, R. S. Bauer, J. Vancea, H. Hoffmann and Ph. Niedermann. Their work appears in journals such as Microelectronics Reliability, Applied Physics Letters, Nanotechnology, Journal of Non-Crystalline Solids and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.