IEEE Transactions on Components and Packaging Technologies
About
The 1.2k papers published in IEEE Transactions on Components and Packaging Technologies in the last decades have received a total of 24.1k indexed citations.
Papers published in IEEE Transactions on Components and Packaging Technologies usually cover Electrical and Electronic Engineering (775 papers), Mechanical Engineering (515 papers) and Mechanics of Materials (241 papers) specifically the topics of Electronic Packaging and Soldering Technologies (471 papers), 3D IC and TSV technologies (288 papers) and Heat Transfer and Optimization (199 papers). The most active scholars publishing in IEEE Transactions on Components and Packaging Technologies are Issam Mudawar, Michael Pecht, M. M. Yovanovich, Roger A. Dougal, C.P. Wong, R. S. Timsit, Suresh V. Garimella, J. R. Culham, Avram Bar‐Cohen and Shengyi Liu.
In The Last Decade
Fields of papers published in IEEE Transactions on Components and Packaging Technologies
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
This network shows the specialization of papers published in IEEE Transactions on Components and Packaging Technologies. Nodes represent fields, and links connect fields that are likely to share authors.
Countries where authors publish in IEEE Transactions on Components and Packaging Technologies
Since SpecializationTotal citations of papers
This map shows the geographic distribution of research published in IEEE Transactions on Components and Packaging Technologies. It shows the number of citations received by papers published by authors working in each country. You can also color the map by specialization and compare the number of papers published in IEEE Transactions on Components and Packaging Technologies with the expected number of papers based on a country's size and research output (numbers larger than one mean the country's share of papers is larger than expected).
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