Yipu Du

916 citations
18 papers · 760 · h-index 12

Impact in

Papers in

Yipu Du

17 papers receiving 751 citations

Peers

Yipu Du
Comparison fields: 5 of 58
  • Biomedical Engineering 462
  • Automotive Engineering 122
  • Polymers and Plastics 118
  • Surfaces, Coatings and Films 43
  • Electrical and Electronic Engineering 288
Replace Zilong Peng with:
Zilong Peng China
Guangming Zhang China
Hongda Lu Australia
Alexandre Poulin Switzerland
Tengyuan Zhang China
Jiyoung Jung South Korea
Ravi Tutika United States
Guangyong Li China
Hongyu Luo China
Sin Kwon South Korea
Yipu Du relative to Zilong Peng China Zilong Peng's profile →
Citations per field
00.5×1.5×
Zilong Peng · 1×
Citations per year

Countries citing papers authored by Yipu Du

Since Specialization
Citations

This map shows the geographic impact of Yipu Du's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yipu Du with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yipu Du more than expected).

Fields of papers citing papers by Yipu Du

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yipu Du. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yipu Du. The network helps show where Yipu Du may publish in the future.

Co-authors

The 25 scholars most cited alongside Yipu Du, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Yipu Du Line = papers co-authored together Yipu Du links everyone, so they are left out of the graph.

All Works

18 of 18 papers shown
#Work
1 2020142
2 2023119
3 2019103
4 202189
5 202187
6 202167
7 202043
8 202322
9 202119
10 202517
11 201913
12 202212
13 202411
14 20246
15 20256
16 20253
17 20251
18 20260

About Yipu Du

Yipu Du is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering, Materials Chemistry, Automotive Engineering and Cognitive Neuroscience, having authored 18 papers that have together received 760 indexed citations. Recurring topics across this work include Advanced Sensor and Energy Harvesting Materials (10 papers), Nanomaterials and Printing Technologies (7 papers), Tactile and Sensory Interactions (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers), Electrohydrodynamics and Fluid Dynamics (2 papers), Conducting polymers and applications (2 papers), Gas Sensing Nanomaterials and Sensors (2 papers) and Surface Modification and Superhydrophobicity (2 papers). The work is most often cited by research in Biomedical Engineering (462 citations), Automotive Engineering (122 citations), Polymers and Plastics (118 citations), Surfaces, Coatings and Films (43 citations) and Electrical and Electronic Engineering (288 citations). Yipu Du has collaborated with scholars based in United States, China and Qatar. Frequent co-authors include Yanliang Zhang, Minxiang Zeng, Mortaza Saeidi‐Javash, Jizhou Song, Shuang Nie, Min Cai, Jiahao Chen, Chengjun Wang, Babak Anasori and Brian C. Wyatt. Their work appears in journals such as ACS Applied Electronic Materials, Advanced Materials, ACS Applied Materials & Interfaces, Small and Chemical Society Reviews.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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