Jun Wei

283 papers and 16.1k indexed citations i.

Jun Wei has authored 283 papers that have received a total of 16.1k indexed citations. This includes 121 papers in Electrical and Electronic Engineering, 114 papers in Mechanical Engineering and 102 papers in Materials Chemistry. The topics of these papers are Additive Manufacturing and 3D Printing Technologies (61 papers), Electronic Packaging and Soldering Technologies (51 papers) and Additive Manufacturing Materials and Processes (47 papers). Jun Wei is often cited by papers focused on Additive Manufacturing and 3D Printing Technologies (61 papers), Electronic Packaging and Soldering Technologies (51 papers) and Additive Manufacturing Materials and Processes (47 papers) and collaborates with scholars based in Singapore, China and United Kingdom. Jun Wei's co-authors include Mui Ling Sharon Nai, Pan Wang, Kun Zhou, Chen‐Nan Sun and Baicheng Zhang and has published in prestigious journals such as Journal of the American Chemical Society, Advanced Materials and ACS Nano.