Wenchao Yang
About
Wenchao Yang has authored 65 papers that have received a total of 670 indexed citations.
This includes 54 papers in Mechanical Engineering, 28 papers in Materials Chemistry and 19 papers in Electrical and Electronic Engineering. The topics of these papers are Aluminum Alloys Composites Properties (24 papers), Intermetallics and Advanced Alloy Properties (23 papers) and Electronic Packaging and Soldering Technologies (17 papers). Wenchao Yang is often cited by papers focused on Aluminum Alloys Composites Properties (24 papers), Intermetallics and Advanced Alloy Properties (23 papers) and Electronic Packaging and Soldering Technologies (17 papers) and collaborates with scholars based in China, Hong Kong and Spain. Wenchao Yang's co-authors include Yongzhong Zhan, Mingjun Pang, Xinjiang Zhang, Chunliu Li and Jun Mao and has published in prestigious journals such as Materials Science and Engineering A, Corrosion Science and Surface Science.
In The Last Decade
Fields of papers published by Wenchao Yang
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Wenchao Yang
Since SpecializationCitations
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