Wei‐Ping Dow

60 papers and 3.0k indexed citations i.

Wei‐Ping Dow has authored 60 papers that have received a total of 3.0k indexed citations. This includes 49 papers in Electrical and Electronic Engineering, 27 papers in Materials Chemistry and 16 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electrodeposition and Electroless Coatings (41 papers), Electronic Packaging and Soldering Technologies (30 papers) and Copper Interconnects and Reliability (16 papers). Wei‐Ping Dow is often cited by papers focused on Electrodeposition and Electroless Coatings (41 papers), Electronic Packaging and Soldering Technologies (30 papers) and Copper Interconnects and Reliability (16 papers) and collaborates with scholars based in Taiwan, United States and Japan. Wei‐Ping Dow's co-authors include Ming-Yao Yen, Chih‐Ming Chen, Ta-Jen Huang, Hsuan Lee and Sumei Huang and has published in prestigious journals such as Langmuir, Chemical Communications and Journal of The Electrochemical Society.