Tuck-Boon Chan
Impact in
- Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing
- Parallel Computing and Optimization Techniques
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- Semiconductor materials and devices
- Low-power high-performance VLSI design
- Advancements in Semiconductor Devices and Circuit Design
- VLSI and FPGA Design Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Memory and Neural Computing
Papers in
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- Low-power high-performance VLSI design 13
- Semiconductor materials and devices 11
- VLSI and FPGA Design Techniques 9
- Advancements in Semiconductor Devices and Circuit Design 9
- Advancements in Photolithography Techniques 7
- Integrated Circuits and Semiconductor Failure Analysis 5
- 3D IC and TSV technologies 3
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- VLSI and Analog Circuit Testing 10
- Co-authors
- Andrew B. Kahng (18 shared papers)Puneet Gupta (11 shared papers)Liangzhen Lai (3 shared papers)John Sartori (1 shared paper)S. Kumar (1 shared paper)Wei-Ting Jonas Chan (3 shared papers)Lerong Cheng (3 shared papers)Ka Man Lai (1 shared paper)
- Journals
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems (2 papers)Canadian Journal of Emergency Medicine (1 paper)Academic Emergency Medicine (1 paper)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (1 paper)Annals of Emergency Medicine (1 paper)
- Partner nations
- United StatesTaiwanSouth Korea
In The Last Decade
Tuck-Boon Chan
33 papers receiving 298 citations
Peers
Comparison fields: 5 of 45
- Hardware and Architecture 127
- Electrical and Electronic Engineering 261
- Industrial and Manufacturing Engineering 12
- Issues, ethics and legal aspects 1
- Conservation 3
Countries citing papers authored by Tuck-Boon Chan
This map shows the geographic impact of Tuck-Boon Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tuck-Boon Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tuck-Boon Chan more than expected).
Fields of papers citing papers by Tuck-Boon Chan
This network shows the impact of papers produced by Tuck-Boon Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tuck-Boon Chan. The network helps show where Tuck-Boon Chan may publish in the future.
Co-authors
The 25 scholars most cited alongside Tuck-Boon Chan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 51 | |
| 2 | 2012 | 38 | |
| 3 | 2013 | 20 | |
| 4 | 2014 | 17 | |
| 5 | 2012 | 14 | |
| 6 | 2010 | 14 | |
| 7 | 2011 | 14 | |
| 8 | 2017 | 13 | |
| 9 | 2010 | 12 | |
| 10 | 2015 | 12 | |
| 11 | 2014 | 11 | |
| 12 | 2010 | 10 | |
| 13 | 2013 | 9 | |
| 14 | 2013 | 9 | |
| 15 | Impact of Adaptive Voltage Scaling on Aging-Aware Signoff | 2013 | 9 |
| 16 | 2014 | 9 | |
| 17 | 2010 | 7 | |
| 18 | 2020 | 7 | |
| 19 | 2016 | 3 | |
| 20 | 2019 | 3 |
About Tuck-Boon Chan
Tuck-Boon Chan is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Emergency Medicine, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 34 papers that have together received 306 indexed citations. Recurring topics across this work include Low-power high-performance VLSI design (13 papers), Semiconductor materials and devices (11 papers), VLSI and Analog Circuit Testing (10 papers), VLSI and FPGA Design Techniques (9 papers), Advancements in Semiconductor Devices and Circuit Design (9 papers), Advancements in Photolithography Techniques (7 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Hardware and Architecture (127 citations), Electrical and Electronic Engineering (261 citations), Industrial and Manufacturing Engineering (12 citations), Issues, ethics and legal aspects (1 citation) and Conservation (3 citations). Tuck-Boon Chan has collaborated with scholars based in United States, Taiwan and South Korea. Frequent co-authors include Andrew B. Kahng, Puneet Gupta, Liangzhen Lai, John Sartori, S. Kumar, Wei-Ting Jonas Chan, Lerong Cheng, Ka Man Lai, Yilong Chang and Jae-Gon Lee. Their work appears in journals such as IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Canadian Journal of Emergency Medicine, Academic Emergency Medicine, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and Annals of Emergency Medicine.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.