Tomohiro Uno
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Terahertz technology and applications
- Integrated Circuits and Semiconductor Failure Analysis
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 12
- Terahertz technology and applications 3
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- Copper Interconnects and Reliability 8
- Co-authors
- Takashi Yamada (7 shared papers)Kohei Tatsumi (11 shared papers)Shin‐Ichi Terashima (4 shared papers)Taiichi Otsuji (3 shared papers)Mitsuhiro Hanabe (3 shared papers)Yahya Moubarak Meziani (2 shared papers)Eiichi Sano (2 shared papers)Hideaki Machida (4 shared papers)
In The Last Decade
Tomohiro Uno
29 papers receiving 430 citations
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 418
- Electronic, Optical and Magnetic Materials 88
- Mechanical Engineering 157
- Astronomy and Astrophysics 39
- Atomic and Molecular Physics, and Optics 73
Countries citing papers authored by Tomohiro Uno
This map shows the geographic impact of Tomohiro Uno's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tomohiro Uno with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tomohiro Uno more than expected).
Fields of papers citing papers by Tomohiro Uno
This network shows the impact of papers produced by Tomohiro Uno. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tomohiro Uno. The network helps show where Tomohiro Uno may publish in the future.
Co-authors
The 19 scholars most cited alongside Tomohiro Uno, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 83 | |
| 2 | 2009 | 71 | |
| 3 | 2010 | 52 | |
| 4 | 2010 | 51 | |
| 5 | 2006 | 41 | |
| 6 | 2000 | 37 | |
| 7 | 2007 | 25 | |
| 8 | 2005 | 18 | |
| 9 | 2013 | 13 | |
| 10 | 2013 | 12 | |
| 11 | 2017 | 12 | |
| 12 | 2001 | 10 | |
| 13 | 1999 | 8 | |
| 14 | 2012 | 6 | |
| 15 | Thermal bond reliability of high reliability gold alloy wires for automotive IC's | 2005 | 6 |
| 16 | 1995 | 5 | |
| 17 | 2017 | 5 | |
| 18 | 1999 | 3 | |
| 19 | 2011 | 3 | |
| 20 | Surface-enhanced copper bonding wire for LSI and its bond reliability under humid environment | 2009 | 2 |
About Tomohiro Uno
Tomohiro Uno is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Biomedical Engineering and Materials Chemistry, having authored 29 papers that have together received 475 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (12 papers), Copper Interconnects and Reliability (8 papers), Aluminum Alloys Composites Properties (3 papers), Phase-change materials and chalcogenides (3 papers), Terahertz technology and applications (3 papers), Plasmonic and Surface Plasmon Research (2 papers) and Lubricants and Their Additives (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (418 citations), Electronic, Optical and Magnetic Materials (88 citations), Mechanical Engineering (157 citations), Astronomy and Astrophysics (39 citations) and Atomic and Molecular Physics, and Optics (73 citations). Tomohiro Uno has collaborated with scholars based in Japan, China and Germany. Frequent co-authors include Takashi Yamada, Kohei Tatsumi, Shin‐Ichi Terashima, Taiichi Otsuji, Mitsuhiro Hanabe, Yahya Moubarak Meziani, Eiichi Sano, Hideaki Machida, Atsushi Ogura and V. Ryzhii. Their work appears in journals such as Journal of the Japan Institute of Metals and Materials, Microelectronics Reliability, Applied Physics Letters, Japanese Journal of Applied Physics and MATERIALS TRANSACTIONS.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.