Ting-Chen Tseng
Impact in
- Biomaterials top 10%
- Electrospun Nanofibers in Biomedical Applications
- Nanoparticle-Based Drug Delivery
- Molecular Medicine top 10%
- Hydrogels: synthesis, properties, applications
Papers in
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- Nerve injury and regeneration 6
- Neuroscience and Neural Engineering 2
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- Electrospun Nanofibers in Biomedical Applications 4
- Nanoparticle-Based Drug Delivery 2
- Co-authors
- Shan‐hui Hsu (11 shared papers)Fu-Yu Hsieh (4 shared papers)Yen Wei (1 shared paper)Patrick Théato (1 shared paper)Ing‐Ming Chiu (1 shared paper)Jeng‐Rung Chen (1 shared paper)Greta Jarockytė (1 shared paper)Ričardas Rotomskis (1 shared paper)
In The Last Decade
Ting-Chen Tseng
11 papers receiving 460 citations
Peers
Comparison fields: 5 of 72
- Biomaterials 184
- Molecular Medicine 55
- Developmental Neuroscience 32
- Cellular and Molecular Neuroscience 120
- Genetics 56
Countries citing papers authored by Ting-Chen Tseng
This map shows the geographic impact of Ting-Chen Tseng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ting-Chen Tseng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ting-Chen Tseng more than expected).
Fields of papers citing papers by Ting-Chen Tseng
This network shows the impact of papers produced by Ting-Chen Tseng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ting-Chen Tseng. The network helps show where Ting-Chen Tseng may publish in the future.
Co-authors
The 16 scholars most cited alongside Ting-Chen Tseng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 95 | |
| 2 | 2016 | 90 | |
| 3 | 2014 | 61 | |
| 4 | 2013 | 57 | |
| 5 | 2012 | 56 | |
| 6 | 2015 | 27 | |
| 7 | 2016 | 24 | |
| 8 | 2016 | 24 | |
| 9 | 2021 | 16 | |
| 10 | 2016 | 9 | |
| 11 | 2014 | 5 |
About Ting-Chen Tseng
Ting-Chen Tseng is a scholar working on Cellular and Molecular Neuroscience, Biomaterials, Biomedical Engineering, Surgery and Molecular Biology, having authored 11 papers that have together received 464 indexed citations. Recurring topics across this work include Nerve injury and regeneration (6 papers), Electrospun Nanofibers in Biomedical Applications (4 papers), Mesenchymal stem cell research (2 papers), Neuroscience and Neural Engineering (2 papers), Graphene and Nanomaterials Applications (2 papers), Tissue Engineering and Regenerative Medicine (2 papers), Nanoparticle-Based Drug Delivery (2 papers) and Advanced biosensing and bioanalysis techniques (1 paper). The work is most often cited by research in Biomaterials (184 citations), Molecular Medicine (55 citations), Developmental Neuroscience (32 citations), Cellular and Molecular Neuroscience (120 citations) and Genetics (56 citations). Ting-Chen Tseng has collaborated with scholars based in Taiwan, Lithuania and Germany. Frequent co-authors include Shan‐hui Hsu, Fu-Yu Hsieh, Yen Wei, Patrick Théato, Ing‐Ming Chiu, Jeng‐Rung Chen, Greta Jarockytė, Ričardas Rotomskis, Vitalijus Karabanovas and Niann‐Tzyy Dai. Their work appears in journals such as Biomaterials, Frontiers in Cell and Developmental Biology, Biomaterials Science, Biofabrication and Cell Transplantation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.