Tim D. Sullivan
Impact in
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
- VLSI and Analog Circuit Testing
- Embedded Systems Design Techniques
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- Radiation Effects in Electronics
- Low-power high-performance VLSI design
Papers in
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- Copper Interconnects and Reliability 5
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- VLSI and Analog Circuit Testing 1
- Co-authors
- James Casey (1 shared paper)Chunhua Hu (1 shared paper)Cyprian E. Uzoh (1 shared paper)D. C. Edelstein (1 shared paper)D. L. Harmon (1 shared paper)Terence B. Hook (1 shared paper)Kenneth P. Rodbell (2 shared papers)Jeff P. Gambino (2 shared papers)
- Journals
- IBM Journal of Research and Development (1 paper)Thin Solid Films (1 paper)International Journal of Plasticity (1 paper)IEEE International Integrated Reliability Workshop final report (1 paper)AIP conference proceedings (1 paper)
- Partner nations
- United States
In The Last Decade
Tim D. Sullivan
9 papers receiving 368 citations
Peers
Comparison fields: 5 of 37
- Hardware and Architecture 52
- Electrical and Electronic Engineering 278
- Computer Networks and Communications 76
- Software 6
- Radiation 9
Countries citing papers authored by Tim D. Sullivan
This map shows the geographic impact of Tim D. Sullivan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tim D. Sullivan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tim D. Sullivan more than expected).
Fields of papers citing papers by Tim D. Sullivan
This network shows the impact of papers produced by Tim D. Sullivan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tim D. Sullivan. The network helps show where Tim D. Sullivan may publish in the future.
Co-authors
The 25 scholars most cited alongside Tim D. Sullivan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1996 | 349 | |
| 2 | 1985 | 26 | |
| 3 | 2001 | 6 | |
| 4 | 2003 | 5 | |
| 5 | 2006 | 5 | |
| 6 | 1996 | 4 | |
| 7 | 2007 | 2 | |
| 8 | 2003 | 1 | |
| 9 | 2006 | 1 | |
| 10 | 1991 | 0 |
About Tim D. Sullivan
Tim D. Sullivan is a scholar working on Electronic, Optical and Magnetic Materials, Hardware and Architecture, Mechanics of Materials, Electrical and Electronic Engineering and Atomic and Molecular Physics, and Optics, having authored 10 papers that have together received 399 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (5 papers), Metal and Thin Film Mechanics (1 paper), Electrostatic Discharge in Electronics (1 paper), Integrated Circuits and Semiconductor Failure Analysis (1 paper), VLSI and Analog Circuit Testing (1 paper), Radiation Effects in Electronics (1 paper), Metal Forming Simulation Techniques (1 paper) and Semiconductor materials and interfaces (1 paper). The work is most often cited by research in Hardware and Architecture (52 citations), Electrical and Electronic Engineering (278 citations), Computer Networks and Communications (76 citations), Software (6 citations) and Radiation (9 citations). Tim D. Sullivan has collaborated with scholars based in United States. Frequent co-authors include James Casey, Chunhua Hu, Cyprian E. Uzoh, D. C. Edelstein, D. L. Harmon, Terence B. Hook, Kenneth P. Rodbell, Jeff P. Gambino, Alvin W. Strong and Edward W. Kiewra. Their work appears in journals such as IBM Journal of Research and Development, Thin Solid Films, International Journal of Plasticity, IEEE International Integrated Reliability Workshop final report and AIP conference proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.