Thomas E. Sarvey
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
-
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
Papers in
-
- Heat Transfer and Optimization 24
- Heat Transfer and Boiling Studies 15
-
- 3D IC and TSV technologies 12
- Silicon Carbide Semiconductor Technologies 6
- Thin-Film Transistor Technologies 3
- Co-authors
- Muhannad S. Bakir (30 shared papers)Yogendra Kumar Joshi (16 shared papers)Andrei Fedorov (13 shared papers)Xuchen Zhang (9 shared papers)Yuanchen Hu (5 shared papers)Peter A. Kottke (12 shared papers)Suresh K. Sitaraman (6 shared papers)Xuefei Han (3 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)Journal of Electronic Packaging (3 papers)International Journal of Heat and Mass Transfer (2 papers)ASME Journal of Heat and Mass Transfer (1 paper)IEEE Conference Proceedings (1 paper)
- Partner nations
- United StatesChina
In The Last Decade
Thomas E. Sarvey
30 papers receiving 536 citations
Peers
Comparison fields: 5 of 32
- Mechanical Engineering 391
- Electrical and Electronic Engineering 252
- Computational Mechanics 70
- Hardware and Architecture 16
- Biomedical Engineering 77
Countries citing papers authored by Thomas E. Sarvey
This map shows the geographic impact of Thomas E. Sarvey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas E. Sarvey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas E. Sarvey more than expected).
Fields of papers citing papers by Thomas E. Sarvey
This network shows the impact of papers produced by Thomas E. Sarvey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas E. Sarvey. The network helps show where Thomas E. Sarvey may publish in the future.
Co-authors
The 24 scholars most cited alongside Thomas E. Sarvey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 113 | |
| 2 | 2015 | 58 | |
| 3 | 2017 | 43 | |
| 4 | 2017 | 30 | |
| 5 | 2015 | 27 | |
| 6 | 2017 | 27 | |
| 7 | 2017 | 23 | |
| 8 | 2016 | 22 | |
| 9 | 2014 | 21 | |
| 10 | 2016 | 19 | |
| 11 | 2019 | 16 | |
| 12 | 2019 | 15 | |
| 13 | 2021 | 14 | |
| 14 | 2015 | 13 | |
| 15 | 2016 | 12 | |
| 16 | 2016 | 12 | |
| 17 | 2015 | 11 | |
| 18 | 2017 | 11 | |
| 19 | 2014 | 11 | |
| 20 | 2020 | 9 |
About Thomas E. Sarvey
Thomas E. Sarvey is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Mechanics, Hardware and Architecture and Control and Systems Engineering, having authored 30 papers that have together received 557 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (24 papers), Heat Transfer and Boiling Studies (15 papers), 3D IC and TSV technologies (12 papers), Fluid Dynamics and Thin Films (8 papers), Silicon Carbide Semiconductor Technologies (6 papers), Iterative Learning Control Systems (3 papers), Parallel Computing and Optimization Techniques (3 papers) and Thin-Film Transistor Technologies (3 papers). The work is most often cited by research in Mechanical Engineering (391 citations), Electrical and Electronic Engineering (252 citations), Computational Mechanics (70 citations), Hardware and Architecture (16 citations) and Biomedical Engineering (77 citations). Thomas E. Sarvey has collaborated with scholars based in United States and China. Frequent co-authors include Muhannad S. Bakir, Yogendra Kumar Joshi, Andrei Fedorov, Xuchen Zhang, Yuanchen Hu, Peter A. Kottke, Suresh K. Sitaraman, Xuefei Han, Arifur Rahman and Aravind R. Dasu. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, International Journal of Heat and Mass Transfer, ASME Journal of Heat and Mass Transfer and IEEE Conference Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.