T.F. Lemczyk
Impact in
- Mechanical Engineering top 10%
- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
Papers in
-
- Heat Transfer and Optimization 5
- Heat Transfer Mechanisms 2
- Tribology and Lubrication Engineering 2
-
- 3D IC and TSV technologies 4
- Silicon Carbide Semiconductor Technologies 3
- Co-authors
- M. M. Yovanovich (12 shared papers)J. R. Culham (7 shared papers)P. Teertstra (1 shared paper)G. M. L. Gladwell (1 shared paper)
- Journals
- Journal of Electronic Packaging (2 papers)International Journal of Heat and Mass Transfer (2 papers)Computers & Mathematics with Applications (1 paper)Journal of Thermophysics and Heat Transfer (1 paper)Heat Transfer Engineering (1 paper)
- Partner nations
- CanadaUnited States
In The Last Decade
T.F. Lemczyk
14 papers receiving 330 citations
Peers
Comparison fields: 5 of 47
- Mechanical Engineering 211
- Electrical and Electronic Engineering 129
- Mechanics of Materials 48
- Computational Mechanics 37
- Hardware and Architecture 11
Countries citing papers authored by T.F. Lemczyk
This map shows the geographic impact of T.F. Lemczyk's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.F. Lemczyk with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.F. Lemczyk more than expected).
Fields of papers citing papers by T.F. Lemczyk
This network shows the impact of papers produced by T.F. Lemczyk. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.F. Lemczyk. The network helps show where T.F. Lemczyk may publish in the future.
Co-authors
The 4 scholars most cited alongside T.F. Lemczyk, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 136 | |
| 2 | 2003 | 38 | |
| 3 | 2000 | 36 | |
| 4 | 1992 | 22 | |
| 5 | 1988 | 22 | |
| 6 | 2002 | 21 | |
| 7 | 1987 | 20 | |
| 8 | 1988 | 20 | |
| 9 | 1988 | 16 | |
| 10 | 1988 | 14 | |
| 11 | 1988 | 13 | |
| 12 | 2003 | 2 | |
| 13 | 1988 | 1 | |
| 14 | 1986 | 1 |
About T.F. Lemczyk
T.F. Lemczyk is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Mechanics of Materials, Materials Chemistry and Automotive Engineering, having authored 14 papers that have together received 362 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (5 papers), Adhesion, Friction, and Surface Interactions (4 papers), 3D IC and TSV technologies (4 papers), Brake Systems and Friction Analysis (3 papers), Silicon Carbide Semiconductor Technologies (3 papers), Thermal properties of materials (3 papers), Heat Transfer Mechanisms (2 papers) and Tribology and Lubrication Engineering (2 papers). The work is most often cited by research in Mechanical Engineering (211 citations), Electrical and Electronic Engineering (129 citations), Mechanics of Materials (48 citations), Computational Mechanics (37 citations) and Hardware and Architecture (11 citations). T.F. Lemczyk has collaborated with scholars based in Canada and United States. Frequent co-authors include M. M. Yovanovich, J. R. Culham, P. Teertstra and G. M. L. Gladwell. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Heat and Mass Transfer, Computers & Mathematics with Applications, Journal of Thermophysics and Heat Transfer and Heat Transfer Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.