Tae‐Ik Lee
Impact in
- Polymers and Plastics top 5%
- Conducting polymers and applications
- Biomedical Engineering top 2%
- Advanced Sensor and Energy Harvesting Materials
- Dielectric materials and actuators
Papers in
-
- Electronic Packaging and Soldering Technologies 22
- 3D IC and TSV technologies 13
- Nanomaterials and Printing Technologies 6
-
- Advanced Sensor and Energy Harvesting Materials 21
- Nanofabrication and Lithography Techniques 5
- Advanced Surface Polishing Techniques 4
- Co-authors
- Taek‐Soo Kim (35 shared papers)Donguk Kwon (4 shared papers)Inkyu Park (4 shared papers)Min Seong Kim (3 shared papers)Seung‐Hwan Kim (2 shared papers)Seunghwa Ryu (2 shared papers)Jongmin Shim (1 shared paper)Min Sung Kim (7 shared papers)
- Journals
- ACS Applied Materials & Interfaces (6 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)Microelectronics Reliability (3 papers)Advanced Functional Materials (2 papers)Polymer Testing (2 papers)
- Partner nations
- South KoreaUnited StatesGermany
In The Last Decade
Tae‐Ik Lee
44 papers receiving 1.4k citations
Tae‐Ik Lee's Hit Papers
Peers
Comparison fields: 5 of 76
- Polymers and Plastics 431
- Biomedical Engineering 1.1k
- Cognitive Neuroscience 380
- Electrical and Electronic Engineering 663
- Bioengineering 45
Countries citing papers authored by Tae‐Ik Lee
This map shows the geographic impact of Tae‐Ik Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae‐Ik Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae‐Ik Lee more than expected).
Fields of papers citing papers by Tae‐Ik Lee
This network shows the impact of papers produced by Tae‐Ik Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae‐Ik Lee. The network helps show where Tae‐Ik Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Tae‐Ik Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 47 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Highly Sensitive, Flexible, and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer Hit paper breakdown → | 2016 | 451 |
| 2 | 2019 | 216 | |
| 3 | 2018 | 101 | |
| 4 | 2019 | 94 | |
| 5 | 2016 | 45 | |
| 6 | 2016 | 44 | |
| 7 | 2018 | 37 | |
| 8 | 2018 | 37 | |
| 9 | 2019 | 34 | |
| 10 | 2015 | 34 | |
| 11 | 2015 | 32 | |
| 12 | 2016 | 31 | |
| 13 | 2019 | 31 | |
| 14 | 2017 | 26 | |
| 15 | 2016 | 26 | |
| 16 | 2016 | 25 | |
| 17 | 2020 | 20 | |
| 18 | 2016 | 18 | |
| 19 | 2016 | 18 | |
| 20 | 2016 | 15 |
About Tae‐Ik Lee
Tae‐Ik Lee is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Polymers and Plastics, Mechanics of Materials and Mechanical Engineering, having authored 47 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), Advanced Sensor and Energy Harvesting Materials (21 papers), 3D IC and TSV technologies (13 papers), Conducting polymers and applications (6 papers), Nanomaterials and Printing Technologies (6 papers), Adhesion, Friction, and Surface Interactions (5 papers), Nanofabrication and Lithography Techniques (5 papers) and Advanced Surface Polishing Techniques (4 papers). The work is most often cited by research in Polymers and Plastics (431 citations), Biomedical Engineering (1.1k citations), Cognitive Neuroscience (380 citations), Electrical and Electronic Engineering (663 citations) and Bioengineering (45 citations). Tae‐Ik Lee has collaborated with scholars based in South Korea, United States and Germany. Frequent co-authors include Taek‐Soo Kim, Donguk Kwon, Inkyu Park, Min Seong Kim, Seung‐Hwan Kim, Seunghwa Ryu, Jongmin Shim, Min Sung Kim, Cheolgyu Kim and Kyung‐Wook Paik. Their work appears in journals such as ACS Applied Materials & Interfaces, IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Advanced Functional Materials and Polymer Testing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.